Abstract
We stated in Chapter 19 that heat conduction can be described as the transfer of thermal energy from the hot to the cold part of a piece of material. We shall discuss now the mechanisms which are involved in this transfer of thermal energy.
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© 2001 Springer-Verlag New York, Inc.
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Hummel, R.E. (2001). Thermal Conduction. In: Electronic Properties of Materials. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-86538-1_21
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DOI: https://doi.org/10.1007/978-3-642-86538-1_21
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-86540-4
Online ISBN: 978-3-642-86538-1
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