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Implantation into Fullerites

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Electronic Properties of Fullerenes

Part of the book series: Springer Series in Solid-State Sciences ((SSSOL,volume 117))

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Abstract

Fcc CöO and C70 were irradiated with high-energy heavy ions at low temperature. The landing positions of the iron ions were studied by means of in-beam Mössbauer spectroscopy. For both materials the Mössbauer data indicate that the iron atoms landed on interstitial sites between two fullerene molecules with two pentagons facing each other. In the C70 sample irradiation led to a fcc-to-rhomboheclral phase transition.

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References

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Author information

Authors and Affiliations

  1. Institut für Festkörperphysik, Universität Wien, Strudlhofgasse 4, A-1090, Wien, Austria

    K. Misof, G. Vogl, P. Fratzl & R. Sielemann

  2. Bereich Schwerionenphysik, Hahn-Meitner-Institut Berlin GmbH, Glienicker Str. 100, D-14109, Berlin, Germany

    B. Keck

  3. Shizuoka Institute of Science and Technology, Japan

    Y. Yoshida

Authors
  1. K. Misof
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  2. G. Vogl
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  3. P. Fratzl
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  4. R. Sielemann
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  5. B. Keck
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  6. Y. Yoshida
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Editor information

Editors and Affiliations

  1. Institut für Festkörperphysik, Universität Wien, Strudlhofgasse 4, A-1090, Wien, Austria

    Hans Kuzmany

  2. Kernforschungszentrum Karlsruhe, Institut für Nukleare Festkörperphysik, Postfach 3640, D-76021, Karlsruhe, Germany

    Jörg Fink

  3. Physikalisches Institut II, Universität Stuttgart, Pfaffenwaldring 57, D-70550, Stuttgart, Germany

    Michael Mehring

  4. Max-Planck-Institut für Festkörperforschung, Heisenbergstrasse 1, D-70569, Stuttgart, Germany

    Siegmar Roth

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© 1993 Springer-Verlag Berlin Heidelberg

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Misof, K., Vogl, G., Fratzl, P., Sielemann, R., Keck, B., Yoshida, Y. (1993). Implantation into Fullerites. In: Kuzmany, H., Fink, J., Mehring, M., Roth, S. (eds) Electronic Properties of Fullerenes. Springer Series in Solid-State Sciences, vol 117. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-85049-3_5

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  • DOI: https://doi.org/10.1007/978-3-642-85049-3_5

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-85051-6

  • Online ISBN: 978-3-642-85049-3

  • eBook Packages: Springer Book Archive

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