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Very High Homologous Temperature Constitutive Models for Semi-Solid and Solid Metals

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Summary

Although the constitutive behavior of metals is well characterized for homologous temperatures below one-half the melting temperature, very little data exist for very high homologous temperatures and semi-solid or mushy state constitutive behavior. The deformation processes at high homologous temperatures consist of some combination of dislocation glide and recovery-controlled creep, but it is not clear whether one particular process dominates and therefore which constitutive model is most appropriate. This investigation presents constitutive behavior for both very high homologous temperature deformation and semi-solid deformation processes. The experiments assume an internal variable formulation where the flow equation is coupled with the evolution of microstructure via a set of coupled, first order differential equations. The semi-solid model incorporates a single internal variable to capture the effect of solid particle agglomeration. The high homologous temperature behavior includes both steady state and transient data. Data is presented for both lead and lead/tin systems, illustrating the proper experiments to determine the material functions in the models.

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References

  1. S B Brown, P Kumar, and V. Dave, “High Homologous Temperature Constitutive Behavior of FCC Metals” Constitutive Laws for Engineering Materials, ASME Press, pp. 871–875, 1990.

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© 1992 Springer-Verlag, Berlin Heidelberg

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Brown, S., Kumar, P., Dave, V. (1992). Very High Homologous Temperature Constitutive Models for Semi-Solid and Solid Metals. In: Karlsson, L., Lindgren, LE., Jonsson, M. (eds) Mechanical Effects of Welding. International Union of Theoretical and Applied Mechanics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-84731-8_2

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  • DOI: https://doi.org/10.1007/978-3-642-84731-8_2

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-84733-2

  • Online ISBN: 978-3-642-84731-8

  • eBook Packages: Springer Book Archive

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