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Technical Issues of High-Speed Heterostructure Devices

  • Conference paper
High-Speed Electronics

Part of the book series: Springer Series in Electronics and Photonics ((SSEP,volume 22))

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Abstract

Recently,heterostructure devices have been extensively investigated because of their superior properties and new applications. In addition, the development of new epitaxial techniques, such as molecular beam epitaxy (MBE) and metal organic chemical vapor deposition (MOCVD), have enabled precise control of thickness and doping in the fabrication of those devices. In this paper, relatively orthodox heterostructure devices are discussed from the technical and application points of view. First of all, current technical issues of heterostructure FETs (HFETs) /1/ directed at integrated circuits are described. Next, heterojunction bipolar transistors (HBTs) /2/ are discussed from the same point of view. Finally, current topics of semiconductor.laser diodes concerning fast direct modulation are presented.

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Authors and Affiliations

  1. NTT Electrical Communications Laboratories, Morinosato Wakamiya, Atsugi-shi, Kanagawa, 243-01, Japan

    T. Ikegami, K. Yamasaki, T. Mizutani, T. Ishibashi & M. Fujimoto

Authors
  1. T. Ikegami
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  2. K. Yamasaki
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  3. T. Mizutani
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  4. T. Ishibashi
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  5. M. Fujimoto
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Editor information

Editors and Affiliations

  1. RIFA AB, S-163 81, Stockholm, Sweden

    Bengt Källbäck

  2. Institut für Halbleitertechnik, Rhein.-Westf. Technische Hochschule, Sommerfeldstraße, D-5100, Aachen, Fed. Rep. of Germany

    Heinz Beneking

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© 1986 Springer-Verlag Berlin Heidelberg

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Ikegami, T., Yamasaki, K., Mizutani, T., Ishibashi, T., Fujimoto, M. (1986). Technical Issues of High-Speed Heterostructure Devices. In: Källbäck, B., Beneking, H. (eds) High-Speed Electronics. Springer Series in Electronics and Photonics, vol 22. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82979-6_13

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  • DOI: https://doi.org/10.1007/978-3-642-82979-6_13

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-82981-9

  • Online ISBN: 978-3-642-82979-6

  • eBook Packages: Springer Book Archive

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