Abstract
The electrically conductive polymers such as polyacetylene and polypyrrole have received a great deal of attention in recent years (1). Although polyacetylene, with its greater degree of crystallinity and simple, even prototypical, chemical structure, may be regarded as a more tractable problem in polymer physics, it is now widely recognized that polypyrrole, in the conducting state, is by far the more stable material under ambient conditions. As a result, the prospects for commercial exploitation seem better for polypyrrole, at present, than for polyacetylene. In spite of this, little attention has been paid towards the material properties of this polymer. An early report indicated high tensile strengths in very thin films, but only erroneous values of the Young’s moduli were given (2).
Keywords
- Ultimate Tensile Strength
- Stress Strain Curve
- High Tensile Strength
- Propylene Carbonate
- Stress Strain Relationship
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Proc. Int. Conf. Low-Dimensional Conductors, Les Arcs, France, Dec. 1982, J. de Physique, Coll. C 3, (1983)
A.F. Diaz and K.K. Kanazawa, IBM J.Res.Dev., 27, 342–7 (1983)
A.J. Kinloch and R.J. Young, Fracture Behaviour of Polymers (Applied Science, London, 1983)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1985 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Bloor, D., Hercliffe, R.D., Galiotis, C.G., Young, R.J. (1985). The Mechanical Properties of Polypyrrole Plates. In: Kuzmany, H., Mehring, M., Roth, S. (eds) Electronic Properties of Polymers and Related Compounds. Springer Series in Solid-State Sciences, vol 63. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82569-9_30
Download citation
DOI: https://doi.org/10.1007/978-3-642-82569-9_30
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-82571-2
Online ISBN: 978-3-642-82569-9
eBook Packages: Springer Book Archive