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Energy Dissipation at Metal Surfaces: The Electron-Hole Pair Mechanism

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Dynamical Processes and Ordering on Solid Surfaces

Part of the book series: Springer Series in Solid-State Sciences ((SSSOL,volume 59))

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Abstract

Recently there has been much interest in the energy-transfer between a surface and an atom or molecule approaching the surface. The energy-transfer processes e.g. determine the probability that the incoming particle loses its kinetic energy and is adsorbed at the surface. In the case of metal substrates the excitation of electron-hole pairs presents a mechanism in addition to the excitation of substrate phonons. We will consider here the electron-hole (eh) pair mechanism only. As we have reviewed the theoretical description of this mechanism recently [1], we will focus here on the problems one faces in the case when the inelasticity due to eh-pairs is strong.

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Schönhammer, K., Gunnarsson, O. (1985). Energy Dissipation at Metal Surfaces: The Electron-Hole Pair Mechanism. In: Yoshimori, A., Tsukada, M. (eds) Dynamical Processes and Ordering on Solid Surfaces. Springer Series in Solid-State Sciences, vol 59. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82423-4_8

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  • DOI: https://doi.org/10.1007/978-3-642-82423-4_8

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-82425-8

  • Online ISBN: 978-3-642-82423-4

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