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Laser Diagnostics of Submicron VLSI-Structures

  • J. Bille
  • T. Karte
  • M. Frieben
  • A. Plesch
  • R. W. Wijnaendts
  • R. Kaplan
Conference paper
Part of the Springer Series in Chemical Physics book series (CHEMICAL, volume 39)

Abstract

In spite of the dramatic changes in feature size, die size and defect density, wafer inspection continues to be done manually. However, fast automatic wafer inspection will be a key element for efficient submicron VLSI-process technologies. A new two-step laser scanning procedure is described, resulting in processing speeds of up to 40 million pixels per second and spatial resolution down to 0.1 μm.

Keywords

Point Spread Function Adaptive Optical System Laser Diagnostics Pupil Plane Wavefront Error 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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Copyright information

© Springer-Verlag Berlin Heidelberg 1984

Authors and Affiliations

  • J. Bille
    • 1
  • T. Karte
    • 1
  • M. Frieben
    • 1
  • A. Plesch
    • 1
  • R. W. Wijnaendts
    • 2
  • R. Kaplan
    • 2
  1. 1.Institute of Applied Physics IUniversity of HeidelbergHeidelbergFed. Rep. of Germany
  2. 2.European Molecular Biology LaboratoryHeidelbergFed. Rep. of Germany

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