Abstract
In spite of the dramatic changes in feature size, die size and defect density, wafer inspection continues to be done manually. However, fast automatic wafer inspection will be a key element for efficient submicron VLSI-process technologies. A new two-step laser scanning procedure is described, resulting in processing speeds of up to 40 million pixels per second and spatial resolution down to 0.1 μm.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
G.J. Brakenhoff, P. Blom, and P. Barends, J. Micros. 117, 219–232 (1979)
H.J.B. Marsman, G.J. Brakenhoff, P. Blom, R. Shricker, and R.W. Wijnaendts van Resandt: Rev. Sci. Instruments 54, 1047–1052 (1983)
Hardy, J.W., Proc. IEEE 66, 651 (1978)
Merkle, F., Freischlad, K., Bille, J., Proc. ESO Conference “Scientific Importance of High Angular Resolution at Infrared and Optical Wavelengths”, Garching, March 1981, p. 41 - 52
J. Bille, G. Jahn, A. Dreher Proceedings of the SPIE, Vol. 498 (SPIE’s 28th Annual International Technical Symposium, 19–24 August 1984, San Diego, California )
J. Bille, G. Jahn, M. Frieben, Proceedings of the SPIE, Vol. 332, 269–275 (1982)
G. Zinser, D. Komitowski, J. Bille Proceedings of the VIth International Congress for Pattern Recognition ( ICPR ), München (1982), p. 1173–1175
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1984 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Bille, J., Karte, T., Frieben, M., Plesch, A., Wijnaendts, R.W., Kaplan, R. (1984). Laser Diagnostics of Submicron VLSI-Structures. In: Bäuerle, D. (eds) Laser Processing and Diagnostics. Springer Series in Chemical Physics, vol 39. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82381-7_58
Download citation
DOI: https://doi.org/10.1007/978-3-642-82381-7_58
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-82383-1
Online ISBN: 978-3-642-82381-7
eBook Packages: Springer Book Archive