Laser Diagnostics of Submicron VLSI-Structures
In spite of the dramatic changes in feature size, die size and defect density, wafer inspection continues to be done manually. However, fast automatic wafer inspection will be a key element for efficient submicron VLSI-process technologies. A new two-step laser scanning procedure is described, resulting in processing speeds of up to 40 million pixels per second and spatial resolution down to 0.1 μm.
KeywordsPoint Spread Function Adaptive Optical System Laser Diagnostics Pupil Plane Wavefront Error
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