SIMS Depth Profiling of Shallow As Implants in Si and SiO2

  • W. Vandervorst
  • H. Maes
  • R. De Keersmaecker
Conference paper
Part of the Springer Series in Chemical Physics book series (CHEMICAL, volume 36)


The usefulness of SIMS as a process tool in integrated circuits has been investigated. As a testcase shallow As implants (4–40 keV) in Si and SiO2 are measured and the range parameters (projected range, range straggling, skewness and kurtosis) are derived [1]. It is shown that the measurements of these shallow profiles are extremely sensitive to disturbing effects such as collisional mixing and/or radiation enhanced diffusion. The effect of the primary energy and of the primary mass on the measured profiles is discussed in terms of these two mechanisms. It is found that very low primary energies are mandatory for measuring shallow profiles without disturbing effects. However,a lower limit for oxygen bombardment of SiO2 is encountered below which the sensitivity drops over orders of magnitude.


Primary Energy Decay Length Disturbing Effect Primary Mass Oxygen Bombardment 
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Copyright information

© Springer-Verlag Berlin Heidelberg 1984

Authors and Affiliations

  • W. Vandervorst
    • 1
  • H. Maes
    • 1
  • R. De Keersmaecker
    • 1
  1. 1.KU Leuven, ESAT, KardHeverleeBelgium

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