Abstract
This work describes how 40keV protons may be used to measure the concentration profiles of boron implanted into silicon. The protons are used to generate boron-K X-rays (~180 eV) which are shown to arise predominantly from within 350 Å below the silicon surface. In order to minimise the interfering effect of silicon-L X-rays (~100eV) which are generated simultaneously, a specially developed boron filter was incorporated into the X-ray detector. The samples investigated were implanted with boron at 100keV, 200keV and 300keV, to a dose of 5 • 1016 boron ions/cm2. In a preliminary investigation of the lattice location of the implanted boron, results are presented which are consistent with the boron occupying sites along the <110> atomic rows.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Cairns, J.A., Holloway, D.F., Nelson, R.S.: from “Atomic Collision Phenomena in Solids”, editors D.W. Palmer, M.W. Thompson and P.D. Townsend. North-Holland Publishing Co. (1970) p. 541.
Cairns, J.A., Nelson, R.S.: Rad. Effects 7, 163 (1971).
Cairns, J.A., Holloway, D.F., Nelson, R.S.: European Conference onion Implantation, Peter Peregrinus Ltd. (1970) p. 203.
Cairns, J.A., Holloway, D.F.: Nucl. Instrum. Methods (to be published).
Cairns, J.A., Benneworth, B., Yeates, R.C.: A.E.R.E. (Harwell) R-6787 (to be published in Nucl. Instrum. Methods).
North, J.C., Gibson, W.M.: Appl. Phys. Lett. 16, 126 (1970).
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 1971 Springer-Verlag, Berlin · Heidelberg
About this paper
Cite this paper
Cairns, J.A., Nelson, R.S., Briggs, J.S. (1971). The Use of Ion-Induced X-Rays to Investigate the Concentration Distribution and Atom Location of Boron-Implanted Silicon. In: Ruge, I., Graul, J. (eds) Ion Implantation in Semiconductors. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-80660-5_41
Download citation
DOI: https://doi.org/10.1007/978-3-642-80660-5_41
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-80662-9
Online ISBN: 978-3-642-80660-5
eBook Packages: Springer Book Archive