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High-Temperature Deformation of Metals and Alloys

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Dislocation Dynamics and Plasticity

Part of the book series: Springer Series in Materials Science ((SSMATERIALS,volume 12))

Abstract

The special aspect of high-temperature deformation is that the effect of diffusion is pronounced. The dislocations can climb as well as glide so that recovery due to dislocation rearrangement and pair annihilation proceeds quickly. Sometimes recrystallization occurs during deformation. For polycrystalline metals, grain boundary sliding and migration also play an important role. Under a very low stress, the deformation occurs not by dislocation motion, but exclusively by diffusion. In this chapter, the characteristics of high-temperature deformation are shown by using the deformation mechanism map. The problems special to high-temperature deformation, and the experimental techniques to settle them, are given to help the understanding of the deformation mechanism described in the following chapters.

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Author information

Authors and Affiliations

  1. Department of Materials Science and Technology, Faculty of Industrial Science and Technology, University of Tokyo, Noda, Chiba 278, Japan

    Professor Taira Suzuki

  2. Institute for Solid State Physics, University of Tokyo, Roppongi, Minato-Ku, Tokyo 106, Japan

    Professor Shin Takeuchi

  3. Graduate School of Engineering Sciences, Kyushu University, Kasuga-shi, Fukuoka 816, Japan

    Professor Hideo Yoshinaga

Authors
  1. Professor Taira Suzuki
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  2. Professor Shin Takeuchi
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  3. Professor Hideo Yoshinaga
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© 1991 Springer-Verlag Berlin Heidelberg

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Suzuki, T., Takeuchi, S., Yoshinaga, H. (1991). High-Temperature Deformation of Metals and Alloys. In: Dislocation Dynamics and Plasticity. Springer Series in Materials Science, vol 12. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-75774-7_8

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  • DOI: https://doi.org/10.1007/978-3-642-75774-7_8

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-75776-1

  • Online ISBN: 978-3-642-75774-7

  • eBook Packages: Springer Book Archive

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