Abstract
Plasma etching processes in the semiconductor industry are accompanied by the formation of waste products with potential toxicity. There is only limited knowledge about the occupational and environmental risks of these substances.
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Graf U, Juon H, Katz AJ, Frei HJ, Würgler FE (1983) A pilot study on a new Drosophila spot test. Mut Res 120:233–239
Graf U, Würgler FE, Katz AJ, Frei H, Juon H, Hall CB, Kale PG (1984) Somatic mutation and recombination test in Drosophila melanogaster. Invironm Mutag 6:153–188
Werner N, Freye H-A, Scheufler H (1985) Die kombinierte Prüfung auf Mutagenität und Teratogenität an der Labormaus – Versuche mit Cyclophosphamid und Ethylmethansulphonat. Biol Rdsch 23:251–254
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© 1991 Springer-Verlag Berlin Heidelberg
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Bauer, S. et al. (1991). Toxicological Investigations of Waste Products from the Plasma Etching Process in the Semiconductor Industry. In: Chambers, P.L., Chambers, C.M., Wiezorek, W.D., Golbs, S. (eds) Recent Developments in Toxicology: Trends, Methods and Problems. Archives of Toxicology, vol 14. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-74936-0_65
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DOI: https://doi.org/10.1007/978-3-642-74936-0_65
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-51422-0
Online ISBN: 978-3-642-74936-0
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