Abstract
Silicon single crystals for semiconductor device applications are usually produced in the form of slices, with a diameter in the range 5 – 15 cm and thickness in the range 0.02 – 0.06 cm. The slice is then characterized by two major surfaces — the front and back. These surfaces have very different mechanical finishing: the front is mirror finished with extremely low roughness (peak-to-peak average distance below 30 Å), while the back is usually strongly damaged; the reasons for this finishing will become clear in the following section.
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© 1989 Springer-Verlag Berlin Heidelberg
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Cerofolini, G., Meda, L. (1989). Gettering. In: Physical Chemistry of, in and on Silicon. Springer Series in Materials Science, vol 8. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-73504-2_9
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DOI: https://doi.org/10.1007/978-3-642-73504-2_9
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