Abstract
A new generation of yaw rate sensor with a linear acceleration sensor, both based on silicon micromachining, is presented. The sensor is designed for mass production and high performance applications like the Vehicle Dynamic Control System VDC. For the yaw rate sensor a combination of surface and bulk micromachining is used. The linear acceleration sensor is build in surface micromachining. Both measuring elements and the ASIC are assembled on a hybrid. This leads to an advantage in design, signal evaluation and packaging. The designs of the measuring elements, the assembly, the interface and the characterization results of the current device are presented.
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References
M.W.Putty, K.Najfi, “A Micromachined Vibrating Ring Gyroscope”, Solid- State Sensor and Actuator Workshop, June 13–16, 1994.
J. D. Johnson, S. Z. Zarabadi, D. R. Sparks, “Surface Micromachined Angular Rate Sensor”, SAE Technical Paper Series, 950538.
J. Bernstein S.Cho, A. T. King, A. Kourepenis, P. Maciel, M. Weinberg, “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope” 0–7803–0957–2/93, 1993 IEEE.
K. Funk, A.Schilp, M. Offenberg, „Surface-micromachining of Resonant Silicon Structures“, Transducers ‘95, 519-News, page 50.
M Hashimoto, C. Cabuz, K. Minami, M. Esashi, “Silicon Resonant Angular Rate Sensor Using Electromagnetic Excitation and Capacitive Detection”, Technical Digest of the 12th Sensor Symposium, 1994.
K. Tanaka, Y. Mochida, M. Sugimoto, K. Moriya, T. Hasegawa, K. Atsuchi, K. Ohwada, “ A Micromachined Vibrating Gyroscope”, Sensors and Actuators A 50 (1995).
Y. Cho, B. M. Kwak, A. P. Pisano, R. Howe, “Slide film damping in laterally driven microstructures”, Sensors and Actuators A, 40 (1994).
M. Offenberg, F.Larmer, B.Eisner, H.Münzel, W. Riethmuller, “Novel Process for a Monolithic Integrated Accelerometer”, Transducers 95, 148 - C4.
K. H.-L. Chau, S.R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, R. G. Marcheselli, “An integrated Force-Balanced Capacitive Accelerometer for Low-G Applications”, Transducers 95, 149 –C4.
M. Offenberg, B. Eisner, F. Larmer, Electrochem. Soc. Fall-Meeting 1994, Ext. Abstr. No 671.
M. Offenberg, H. Miinzel, D. Schubert, Acceleration Sensor in Surface Micromachining for Airbag Applications with High Signal/Noise Ratio, SAE Technical Paper, 960758.
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© 1998 Springer-Verlag Berlin Heidelberg
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Golderer, W. et al. (1998). Yaw Rate Sensor in Silicon Micromachining Technology for Automotive Applications. In: Ricken, D.E., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 98. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-72146-5_6
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DOI: https://doi.org/10.1007/978-3-642-72146-5_6
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-72148-9
Online ISBN: 978-3-642-72146-5
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