Abstract
Emerging assembly technology include both flip chip and chip scale packaging. Both of them provide excellent capabilities to fulfill the needs of today’s and tomorrow’s requirements in automotive applications. These products must withstand high temperature, vibrations, wear and abuse.
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© 1998 Springer-Verlag Berlin Heidelberg
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Heinricht, K., Kloeser, J., Kutzner, K., Lauter, L., Aschenbrenner, R., Reichl, H. (1998). Emerging Assembly Technology for Automotive Applications. In: Ricken, D.E., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 98. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-72146-5_35
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DOI: https://doi.org/10.1007/978-3-642-72146-5_35
Publisher Name: Springer, Berlin, Heidelberg
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