Skip to main content

New High-Temperature Sensors for Innovative Engine Management

  • Conference paper

Part of the book series: VDI-Buch ((VDI-BUCH))

Abstract

Requirements on future vehicles are reduction of energy consumption and emissions. To fulfil these, an optimization of the combustion process including all relevant parameters is necessary and therefore parameter field based control systems have to be replaced by closed loop regulating circuits. To realize the latter in series applications, new types of sensors designed for high temperatures and harsh environments have to be developed. The present paper describes the development of a combustion pressure sensor based on cubic Silicon Carbide (β-SiC) layers on Silicon. Results of in-cylinder measurements will be given in comparison to a Kistler reference sensor. SiC technology based on the hexagonal 4H and 6H polytypes we are developing for integrated signal electronics. The latter is needed for smart sensors and independently operating modules, applied in harsh environments. JFET transistors, which are the basis for monolithic circuit design, will be described and I-V-characteristics measured at elevated temperatures up to 400°C will be given.

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Literature

  1. J.S. Shor, D. Goldstein, A.D. Kurtz, IEEE Transactions on Electron Devices, Vol. 40, No. 6, 1993, S. 1093.

    Article  Google Scholar 

  2. Landolt-Bornstein, Zahlenwerte und Funktionen aus Naturwissenschaften und Technik, Springer-Verlag Berlin, Volume 17, Semiconductors, (1984), S. 118.

    Google Scholar 

  3. Data in Science and Technology, O. Madelung (Herausgeber), Springer- Verlag Berlin, Semiconductors, (1991).

    Google Scholar 

  4. G.A. Slack, Silicon Carbide -1973, R.C. Marshall, J.W. Faust jr., C.E. Ryan (Herausgeber), University of South Carolina Press, Columbia South Carolina, (1973), S. 527.

    Google Scholar 

  5. Y.A. Vodakov, E.N. Mokhov, Silicon Carbide -1973, R.C. Marshall, J.W. Faust jr., C.E. Ryan ( Herausgeber ), University of South Carolina Press. Columbia South Carolina, (1973),S. 508.

    Google Scholar 

  6. J. von Berg, R. Ziermann, W. Reichert, E. Obermeier, M. Eickhoff, G. Krotz, U. Thoma, Th. Boltshauser, C. Cavalloni, J.P. Nendza, Proceedings ICSC Stockholm, 1997.

    Google Scholar 

  7. J. W. Palmour et al. Appl. Phys. Lett. 51 (24), pp 2028 (1987).

    Article  Google Scholar 

  8. D.M.Brown et al. Transactions of the HiTEC 1994, pp XI-17.

    Google Scholar 

  9. D.B. Slater et al. Transactions of the HiTEC 1996, pp X VI 27.

    Google Scholar 

  10. S.Sheppard et al. to be published in Proc. of the ICSCIII-N 1997.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1998 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Krötz, G., Wondrak, W., Eickhoff, M., Lauer, V., Obermeier, E., Cavalloni, G. (1998). New High-Temperature Sensors for Innovative Engine Management. In: Ricken, D.E., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 98. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-72146-5_21

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-72146-5_21

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-72148-9

  • Online ISBN: 978-3-642-72146-5

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics