Skip to main content

CVD Diamond: A New and Promising Material

  • Chapter
  • 550 Accesses

Part of the book series: Springer Series in Materials Processing ((SSMATERIALSPROC))

Abstract

The outstanding properties of diamond, including its hardness, chemical inertness, good optical transparency and high thermal conductivity, are well known. The revolutionary finding that diamond can be synthesized at low pressure by the Chemical Vapor Deposition (CVD) method has opened up new fields of technical applications for this interesting material. There exist considerable differences, both with respect to manufacturing and to applications, between low-pressure (CVD) synthetic diamond and High-Pressure/High-Temperature (HPHT) synthetic diamond. The synthesis of CVD diamond can be performed by a variety of methods using conventional laboratory equipment (Chaps. 2–8), while the synthesis of HPHT diamond requires special industrial equipment which is used by very few companies. Many quite different applications for CVD diamond are the object of intensive research and some applications (e.g. heat spreaders) have entered the market (Chaps. 9–17); in contrast, the diamond from HPHT synthesis is almost exclusively used as grit for mechanical applications. Of special interest are market niches, where CVD diamond offers “enabling technologies“ that is the manufacturing of new products such as optical and X-ray windows, special coatings and electronic devices. Only low-pressure synthesis can provide diamond in the shape of wafers and films. The unique possibility of growing layered diamond structures using CVD technology is exploited for adhesion layers on metal tools (Chap. 12) or for δ-doping in electronic devices (Chap. 17).

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. W.G. Eversole, US Patents 3 030 287 and 3 030 188 (1962)

    Google Scholar 

  2. J.C. Angus, H.A. Will, and W.S. Stanko, J. Appl. Phys. 39, 2915 (1968)

    Article  ADS  Google Scholar 

  3. B.V. Deryagin and D.V. Fedoseev, Sci. Am. 233, 102 (1975)

    Article  Google Scholar 

  4. S. Matsumoto and N. Setaka, 8th Japan Carbon Soc. Fall Meeting (1981)

    Google Scholar 

  5. M. Kamo, M. Tsutsumi, Y. Sato, and N. Setaka, 43rd Japan Appl. Phys. Soc. Fall Meeting (1982)

    Google Scholar 

  6. Y. Hirose and N. Kondo, Japan Appl. Phys. Soc. Spring Meeting (1988)

    Google Scholar 

  7. K. Kurihara, K. Sasaki, M. Kawarada, and N. Koshino, Appl. Phys. Lett. 52, 437 (1988)

    Article  ADS  Google Scholar 

  8. J.V. Busch and J.P. Dismukes; in Synthetic Diamond: Emerging CVD Science and Technology, ed. K.E. Spear and J.P. Dismukes (Wiley, New York, 1994), pp. 581–624

    Google Scholar 

  9. S. Lande, Paper 12.1 at Diamond ’96 Conference, Tours (France), 8–13 Sept. (1996)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1998 Springer-Verlag Berlin Heidelberg

About this chapter

Cite this chapter

Dischler, B. (1998). CVD Diamond: A New and Promising Material. In: Dischler, B., Wild, C. (eds) Low-Pressure Synthetic Diamond. Springer Series in Materials Processing. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-71992-9_1

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-71992-9_1

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-71994-3

  • Online ISBN: 978-3-642-71992-9

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics