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The Spin Coating Process Mechanism

  • Conference paper
The Physics and Fabrication of Microstructures and Microdevices

Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 13))

Abstract

The spin coating process is extensively used, particularly in microelectronics, for coating planar or pseudo-planar surfaces. Spin coating has long been accepted as the best coating method for obtaining a thin (0.5–2 μm), uniform, adherent, homogeneous film over the wafer. It is accomplished by floading the substrate with a polymer solution and rotating it at a constant speed (1000–8000 rpm) until the solvent is evaporated.

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Author information

Authors and Affiliations

  1. Centre National d’Etudes des Télécommunications, BP 98, F-38243, Meylan Cedex, France

    A. Weill

Authors
  1. A. Weill
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Editor information

Editors and Affiliations

  1. GEC Research Ltd., East Lane, HA9 7PP, Wembley, Middlesex, England

    Michael J. Kelly

  2. Laboratoire Central de Recherches, Thomson-CSF, F-91401, Orsay, France

    Claude Weisbuch

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© 1986 Springer-Verlag Berlin Heidelberg

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Weill, A. (1986). The Spin Coating Process Mechanism. In: Kelly, M.J., Weisbuch, C. (eds) The Physics and Fabrication of Microstructures and Microdevices. Springer Proceedings in Physics, vol 13. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-71446-7_4

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  • DOI: https://doi.org/10.1007/978-3-642-71446-7_4

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-71448-1

  • Online ISBN: 978-3-642-71446-7

  • eBook Packages: Springer Book Archive

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