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The Spin Coating Process Mechanism

  • A. Weill
Part of the Springer Proceedings in Physics book series (SPPHY, volume 13)

Abstract

The spin coating process is extensively used, particularly in microelectronics, for coating planar or pseudo-planar surfaces. Spin coating has long been accepted as the best coating method for obtaining a thin (0.5–2 μm), uniform, adherent, homogeneous film over the wafer. It is accomplished by floading the substrate with a polymer solution and rotating it at a constant speed (1000–8000 rpm) until the solvent is evaporated.

Keywords

Polymer Solution Solvent Molecule Solubility Parameter Radial Flow Butyl Acetate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 1986

Authors and Affiliations

  • A. Weill
    • 1
  1. 1.Centre National d’Etudes des TélécommunicationsMeylan CedexFrance

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