The Spin Coating Process Mechanism

  • A. Weill
Part of the Springer Proceedings in Physics book series (SPPHY, volume 13)


The spin coating process is extensively used, particularly in microelectronics, for coating planar or pseudo-planar surfaces. Spin coating has long been accepted as the best coating method for obtaining a thin (0.5–2 μm), uniform, adherent, homogeneous film over the wafer. It is accomplished by floading the substrate with a polymer solution and rotating it at a constant speed (1000–8000 rpm) until the solvent is evaporated.


Polymer Solution Solvent Molecule Solubility Parameter Radial Flow Butyl Acetate 
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Copyright information

© Springer-Verlag Berlin Heidelberg 1986

Authors and Affiliations

  • A. Weill
    • 1
  1. 1.Centre National d’Etudes des TélécommunicationsMeylan CedexFrance

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