Abstract
Conventional melt-growth techniques such as float-zoning, Czochralski pulling, or Bridgman growth typically produce crystals in the form of cylindrical ingots. For many applications, only a thin segment of the crystal is required and hence, the ingot is sectioned into wafers. This operation is usually carried out with a diamondedged saw blade by abrasive cutting action. For small-scale usage or for inexpensive crystal materials, this is a generally acceptable processing step. One undesireable consequence is the introduction of surface damage due to the abrasive contact. However, the damage can usually be removed by appropriate etching and polishing procedures.
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Ciszek, T.F. (1981). The Capillary Action Shaping Technique and Its Applications. In: Grabmaier, J. (eds) Silicon. Crystals, vol 5. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-68175-2_3
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DOI: https://doi.org/10.1007/978-3-642-68175-2_3
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