Summary
A novel low-power polysilicon fuse of high reliability was developed. The power consumption is so small that the fuse can be blown with an on-chip circuit. The fuse can be blown with high yield by voltage pulses of an amplitude of approx. 4V and a blowing current of 20…40mA. The fuse is typically blown after 1µs. The total energy consumption amounts to 110nJ. The resistance changes by more than 8 decades. Because of its low power consumption the fuse can be used to realize an on-chip programmable PROM. This offers the possibility to calibrate chips after mounting and packaging. This paper describes the fuse itself and its application for the calibration of micromechanical sensors after packaging.
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© 2001 Springer-Verlag Berlin Heidelberg
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Maier-Schneider, D., Kolb, S., Winkler, B., Werner, W. (2001). Novel Surface-Micromachined Low-Power Fuses for On-Chip Calibration. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_21
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DOI: https://doi.org/10.1007/978-3-642-59497-7_21
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-42150-4
Online ISBN: 978-3-642-59497-7
eBook Packages: Springer Book Archive