Summary
This paper describes the technologies that the MIT Microengine program has developed to realize compact turbomachinery for a wide class of Power MEMS devices. The core technologies involve extensive use of two-sided Deep Reactive Ion Etching (DRIE), via the so-called ‘Bosch process’, as well as aligned bonding of multiple silicon wafers (upwards of 6–7 wafers). Technology considerations placed several important design constraints on the project, most notably the requirement to focus on designs that are comprised of extruded two-dimensional shapes wherein 3-D complexity is achieved through laminations of wafers.
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© 2001 Springer-Verlag Berlin Heidelberg
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Schmidt, M.A. (2001). Technologies for Microturbomachinery. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_1
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DOI: https://doi.org/10.1007/978-3-642-59497-7_1
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