Abstract
Defects may occur during the fabrication process and during the lifetime of integrated circuits. Integrating a faulty device into systems will result in expensive repairs or even in unsafe situations and should be avoided by testing the chips
This section explains defect mechanisms and their consequences for the product quality. Methods for test pattern generation are discussed, and it is shown how these methods can already be supported in the design phase. Modern systems-on-chip often have the capabilities of testing themselves, and recent built-in self-test techniques (BIST) are presented.
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Wunderlich, HJ. (2000). Test and Testable Design. In: Börger, E. (eds) Architecture Design and Validation Methods. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-57199-2_4
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