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The Influence of Interceptive Position on Adhesive Area in Cellular Sandwich Board Patch Repair Method

  • Conference paper
  • First Online:
Proceedings of the First Symposium on Aviation Maintenance and Management-Volume II

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 297))

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Abstract

This text summarizes cellular sandwich board’s development and application and sums up its damage mode and repair method in terms of air applications. We put forward a method of researching the relationship between interceptive position and adhesive area when the cellular sandwich board gets damage and is mended by patch repair method.

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References

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Author information

Authors and Affiliations

  1. Northwestern Polytechnical University, 127 Youyixi Road, Xi’an, Shaanxi, People’s Republic of China

    Hai Tao Wang & Mo Wu

Authors
  1. Hai Tao Wang
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  2. Mo Wu
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Corresponding author

Correspondence to Hai Tao Wang .

Editor information

Editors and Affiliations

  1. Northwestern Polytechnical University, Xi'an, China

    Jinsong Wang

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© 2014 Springer-Verlag Berlin Heidelberg

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Wang, H.T., Wu, M. (2014). The Influence of Interceptive Position on Adhesive Area in Cellular Sandwich Board Patch Repair Method. In: Wang, J. (eds) Proceedings of the First Symposium on Aviation Maintenance and Management-Volume II. Lecture Notes in Electrical Engineering, vol 297. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-54233-6_44

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  • DOI: https://doi.org/10.1007/978-3-642-54233-6_44

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-54232-9

  • Online ISBN: 978-3-642-54233-6

  • eBook Packages: EngineeringEngineering (R0)

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