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Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach

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Design of Adhesive Joints Under Humid Conditions

Part of the book series: Advanced Structured Materials ((STRUCTMAT,volume 25))

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Abstract

We introduce a new adhesion test method for IC molding compounds that can experimentally separate residual stress from adhesion strength. This chapter describes the dependence of the measured true adhesion strength of molding compounds on adherent materials, temperature, and moisture absorption. We also evaluate interface delamination in a moisture-absorbed package by considering the swelling of the molding compound caused by moisture absorption. The predicted interface delamination agrees well with experimental data for moisture-soaked IC packages.

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Authors and Affiliations

  1. Hitachi Research Laboratory, Hitachi, Ltd., Hitachi, Ibaragi, Japan

    Naotaka Tanaka

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  1. Naotaka Tanaka
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Correspondence to Naotaka Tanaka .

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Editors and Affiliations

  1. , Department of Mechanical Engineering, University of Porto, Rua Dr. Roberto Frias, Porto, 4200-465, Portugal

    Lucas F. M. da Silva

  2. , Precision and Intelligence Laboratory, Tokyo Institute of Technology, Nagatsuta-cho,Midori-ku 4259, Yokohama, 226-8502, Japan

    Chiaki Sato

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Tanaka, N. (2013). Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach. In: da Silva, L., Sato, C. (eds) Design of Adhesive Joints Under Humid Conditions. Advanced Structured Materials, vol 25. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-37614-6_6

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