Abstract
We first discuss HfO2-based ternary high-k dielectric films. We emphasize that ternary materials do not only exhibit average properties expected by the mean-media model, but that they also reveal unexpected properties due to structural phase transformation. We also discuss La2O3-based ternary high-k films, where dopant atoms play a key role in stabilizing the hexagonal phase that is inherently the high-k phase of La2O3. Finally, ternary dielectrics for preparing amorphous gate insulators are discussed from the viewpoint of forming random network structure and suppressing long-range ordering. Understanding of ternary systems will hopefully guide us to higher-k dielectric materials and/or those that are highly reliable.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
M. T. Bohr, R. S. Chau, T. Ghani, K. Mistry, Spectrum 10, 29–35 (2007)
A. Toriumi, K. Kita, K. Tomida, Y. Zhao, J. Widiez, T. Nabatame, H. Ota, M. Hirose, IEDM Tech. Dig. 53–56 (2007)
P. W. Peacock, J. Robertson, J. Appl. Phys. 92, 4712 (2002)
S. Miyazaki, J. Vac. Sci. Technol., B 19, 2212 (2001)
V. V. Afanas’ev, A. Stesmans, W. Tsai, Appl. Phys. Lett. 82, 245 (2003)
P. A. Cox, Transition Metal Oxides (Oxford Press, Oxford, 1992)
G. Shang, P. W. Peacook, J. Robertson, Appl. Phys. Lett. 84, 106 (2004)
W. J. Zhu, T.-P. Ma, T. Tamagawa, J. Kim, Y. Di, IEEE Elec. Dev. Lett. 23, 97 (2002)
C. Kittel, Introduction to Solid State Physics, 6th edn. (Wiley, London, 1986)
H. Fröhlich, Theory of Dielectrics, 2nd edn. (Oxford University Press, Oxford, 1958)
K. Tomida, H. Shimizu, K. Kita, K. Kyuno, A. Toriumi, Mat. Res. Symp. Proc. 8111, D10.9.1 (2004)
J. Robertson, P. W. Peacock, Electronic structure and band offsets of high electric constant gate, in High-k Gate Dielectrics, ed. by M. Houssa (IOP, London, 2004), pp. 372
M. W. Pitcher, S. V. Ushakov, A. Navrotsky, B. F. Woodfield, G. Li, J. Boero-Goates, B. M. Tissue, J. Am. Cer. Soc. 88, 160 (2005)
X. Zhao, D. Vanderbilt, Phys. Rev. B. 65, 233106 (2002)
X. Zhao, D. Vanderbilt, Phys. Rev. B. 65, 075105 (2002)
G.-M. Rignanese, X. Gonze, G. Jun, K. Cho, A. Pasquarello, Phys. Rev. B69, 184301 (2004)
K. Kita, K. Kyuno, A. Toriumi, Appl. Phys. Lett. 86, 102906 (2005)
D. W. Stacy, D. R. Wilder, J. Am. Ceram. Soc. 58, 285 (1975)
A. Toriumi, Y. Yamamoto, Y. Zhao, K. Tomida, K. Kita, ECS Trans. 1, 185 (2006)
K. Tomida, K. Kita, K. Kyuno, A. Toriumi, Appl. Phys. Lett. 89, 142902 (2006)
D. Fisher, A. Kersch, Appl. Phys. Lett. 92, 012908 (2008)
J. Widiez, K. Kita, K. Tomida, T. Nishimura, A. Toriumi, Jpn. J. Appl. Phys. 47, 2410 (2008)
M. Komatsu, R. Yasuhara, H. Takahashi, S. Toyoda, H. Kumigashira, M. Oshima, D. Kukuruznyak, T. Chikyow, Appl. Phys. Lett. 89, 172107 (2006)
K. Tomida, K. Kita, A. Toriumi, Jpn. J. Appl. Phys. 50, 11502 (2011)
C. Adelmann, V. Sriramkumar, S. Van Elshocht, P. Lehnen, T. Conard, S. De Gendt, Appl. Phys. Lett. 91, 162902 (2007)
S. Govindarajan, T. S. Boscke, P. Sivasubramani, P. D. Kirsch, B. H. Lee, U. Schroder, S. Ramanathan, B. E. Gnade, Appl. Phys. Lett. 91, 062906 (2007)
D. H. Triyoso, R. I. Hegde, J. K. Schaeffer, R. Gregory, X.-D. Wang, M. Canonico, D. Roan, E. A. Hebert, K. Kim, J. Jiang, R. Rai, V. Kaushik, S. B. Samavedam, J. Vac. Sci. Technol. B 25, 845 (2007)
A. Chin, Y. H. Wu, S. B. Chen, C. C. Liao, W. J. Chen, Dig. VLSI Symp. 16, (2000)
Y. Zhao, K. Kita, K. Kyuno, A. Toriumi, Appl. Phys. Lett. 88, 072904 (2006)
Y. Zhao, K. Kita, K. Kyuno, A. Toriumi, Appl. Phys. Lett. 89, 252905 (2006)
Y. Zhao, K. Kita, K. Kyuno, A. Toriumi, Appl. Phys. Lett. 94, 042901 (2009)
S. Guha, N. A. Bojarczuk, V. Narayanan, Appl. Phys. Lett. 80, 766 (2002)
X.-B. Lu, Z-G Liu, Y-P Wang, Y. Yang, X-P Wang, H.-W Zhou, B-Y Nguyen. J. Appl. Phys. 94, 1229 (2003)
M. Suzuki, T. Yamaguchi, M. Koyama, Tech. Dig. IEDM 2005, 445–448 (2005)
M. Fanciulli, G. Scarel (eds.), Rare Earth Oxide Thin Films (Springer, Berlin, 2007)
W. H. Zachariasen, J. Am. Chem. Soc. 54, 3841 (1932)
J. C. Philips, J. Non-crystalline Solids 34, 153 (1979)
H. Inoue, F. Utsuno, I. Yasui, J. Non-Cryst, Solids 349, 16–21 (2004)
G. Lucovsky, Y. Wu, H. Niimi, V. Misra, J. C. Phillips, J. Vac. Sci. Tech. B17, 1806–1812 (1999)
A. I. Kingon, J-P. Maria, D. Wicaksana, C. Hoffnan, in Extended Abstract of International Workshop on Gate Insulator (IWGI), vol 36 (2001)
R. S. Roth, J. R. Dennis, H. F. McMurdie, Phase Diagrams for Ceramists, vol. 6 p. 145, Fig. 6441 (The American Ceramics Society, 1987)
A. Toriumi, T. Nabatame, T. Horikawa, Mat. Res. Soc. Symp. Proc. 786, 135 (2004)
A. Toriumi, K. Iwamoto, H. Ota, M. Kadoshima, W. Mizubayashi, T. Nabatame, A. Ogawa, K. Tominaga, T. Horikawa, H. Satake, Microelectronic Engineer. 80, 190 (2005)
V. Ushakov, C. E. Brown, A. Navrotsky, J. Mater. Res. 19, 693 (2004)
A. Dimoulas, G. Vellianitis, G. Mavrou, G. Apostolopoulos, A. Travlos, C. Wiemer, M. Fanciulli, Z. M. Rittersma, Appl. Phys. Lett. 85, 3205 (2004)
Y. Yamamoto, K. Kita, K. Kyuno, A. Toriumi, Appl. Phys. Lett. 89, 032903 (2006)
L. Bixner, Mater. Res. Bull. 19, 143 (1984)
N. Umezawa, K. Shiraishi, S. Sugino, A. Tachibana, K. Phmori, K. Kakushima, H. Iwai, T. Chikyow, T. Ohno, Y. Nara, K. Yamada, Appl. Phys. Lett. 91, 132904 (2007)
Y. Zhao, K. Kita, K. Kyuno, A. Toriumi, J. Appl. Phys. 105, 034103 (2009)
J. M. J. Lopes, M. Roeckerath, T. Heeg, E. Rije, J. Schubert, S. Mantl, V. V. Afanas’ev, S. Shamulia, A. Stesmans, Y. Jia, D. G. Schlom, Appl. Phys. Lett. 89, 222902 (2006)
Acknowledgments
This work was partly supported by a Grant-in-Aid for Scientific Research from the Ministry of Education, Culture, Sports, Science and Technology of Japan.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Toriumi, A., Kita, K. (2013). Ternary HfO2 and La2O3 Based High-k Gate Dielectric Films for Advanced CMOS Applications. In: Kar, S. (eds) High Permittivity Gate Dielectric Materials. Springer Series in Advanced Microelectronics, vol 43. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-36535-5_10
Download citation
DOI: https://doi.org/10.1007/978-3-642-36535-5_10
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-36534-8
Online ISBN: 978-3-642-36535-5
eBook Packages: EngineeringEngineering (R0)