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Mechanics of Materials for Microelectronic Components and Packages

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Advanced Materials Modelling for Structures

Part of the book series: Advanced Structured Materials ((STRUCTMAT,volume 19))

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Abstract

Modern microelectronic packages are multi-material structures containing miniaturised components with dimensions in a micrometre range. This, together with their specific in-service conditions, defines main features of realisation of deformation processes in them. The latter need special approaches and techniques both in characterisation and modelling. The chapter deals with some examples of materials used in microelectronic components and packages, namely, lead-free and indium solders. The former is used in many microelectronic devices while the latter is employed predominantly in low-temperature applications. Respective features and deformation mechanisms are presented together with discussion of their implementation in numerical (finite-element) modelling.

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References

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Acknowledgments

The author is grateful to his current and former colleagues, Prof. Changqing Liu, Dr David Whalley, Dr Jicheng Gong, Dr Pradeep Hegde, Dr Hui Xu and Dr Natalie Cheng for their contribution to this research.

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Authors and Affiliations

  1. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Ashby Road, Loughborough, Leics, LE11 3TU, UK

    Vadim V. Silberschmidt

Authors
  1. Vadim V. Silberschmidt
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Correspondence to Vadim V. Silberschmidt .

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Editors and Affiliations

  1. Lehrstuhl für Technische Mechanik, Institut für Mechanik, Universitätsplatz 2, Magdeburg, 39106, Germany

    Holm Altenbach

  2. ONERA / DMSM, av. Division Leclerc 29, Chatillon Cedex, 92322, France

    Serge Kruch

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Silberschmidt, V.V. (2013). Mechanics of Materials for Microelectronic Components and Packages. In: Altenbach, H., Kruch, S. (eds) Advanced Materials Modelling for Structures. Advanced Structured Materials, vol 19. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35167-9_28

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