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Mechanical Destructions of HTSC Josephson Junctions and Composites

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Microstructure and Properties of High-Temperature Superconductors

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Abstract

As it has been shown in Sect. 1.3.8, Josephson effects are connected with a behavior of weak links of superconductors. According to the classification of high-temperature superconducting Josephson junctions (HTSC JJs), presented in Sect. 2.5, special interest from view of strength and fracture toughness is excited by the junctions with intrinsic barriers or interfaces, formed by the intergranular boundaries with different crystallographic orientations, and also HTSC JJs with extrinsic interfaces in the fabrication of which, the artificial normal metallic or insulating barriers are used.

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Notes

  1. 1.

    At the same time, note that those intergranular voids formed, for example, by thermo-mechanical treatment during a multi-stage processing of monocore Bi-2223 tapes, may become the main cause of critical current diminution in the case of prolonged final annealing [1301].

  2. 2.

    The same statement relates also to materials used in HTSC JJs of the S–N–S type, some properties of which are presented in Tables 11.2 and 11.3.

  3. 3.

    The parameter α, in particular, is very important in the estimation of the fracture character, because its increase diminishes the fracture of interface cracking compared with the substrate failure in the plot of dependence of the relative toughness (Γ i /Γ s ) on the phase angle of loading (Ψ) [453].

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Authors and Affiliations

  1. Vorovich Research Institute of Mechanics and Applied Mathematics, Southern Federal University, Stachki Avenue 200/1, Rostov-on-Don, 344090, Russia

    I. A. Parinov

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  1. I. A. Parinov
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Correspondence to I. A. Parinov .

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© 2012 Springer-Verlag Berlin Heidelberg

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Parinov, I.A. (2012). Mechanical Destructions of HTSC Josephson Junctions and Composites. In: Microstructure and Properties of High-Temperature Superconductors. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-34441-1_11

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  • DOI: https://doi.org/10.1007/978-3-642-34441-1_11

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-34440-4

  • Online ISBN: 978-3-642-34441-1

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