Abstract
It is well known now that a nanoimprint lithography process generally consists of stamp modification, spin coating of resist, imprinting, and then etching for pattern transfer. The stamp modification has been already demonstrated in Chap. 4. Before imprinting, the substrate surface is coated by a thin film for imprinting; how to create a uniform imprinted film is a crucial issue. The spin coating is generally a common method to control film thickness. There are three main nanoimprint lithography techniques: hot embossing (HE), UV-based nanoimprint lithography (UV-NIL), and soft lithography. Various soft lithography techniques have been proposed such as microcontact printing (μCP), replica molding (REM), microtransfer molding (μTM), micromolding in capillaries (MIMIC), and solvent-assisted micromolding (SAMIM). They can be widely used in various fields. In nanoimprint lithography process, the controlling of pattern defect, alignment, and full area imprinted pattern are among the hot topics. Recently, a great deal of attention has been paid to soft UV nanoimprint because of the full area conformal contact with the substrate.
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Zhou, W. (2013). Nanoimprint Lithography Process. In: Nanoimprint Lithography: An Enabling Process for Nanofabrication. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-34428-2_6
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DOI: https://doi.org/10.1007/978-3-642-34428-2_6
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