Abstract
According to the influence of temperature on the lifespan of electronic devices, this paper uses the simulated annealing algorithm to optimize the layout of array distributed electronic components, and the finite element method to verify the result. The results show that it can effectively lower the high temperature of the electronic components through the layout optimization. The highest temperature and the average temperature are decreased by 10.49% and 10.41% respectively in this simulation, which indicates the simulated annealing algorithm can effectively solve the problem of layout optimization of components on the printed circuit board and avoid large-scale computing in the traditional algorithm. This algorithm is of practical value in the field of engineering.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Zhang, H.J., Zhang, Y.: The research of layout problem Based on simulated annealing algorithm. Computer Engineering and Design 27(11), 1985–1988 (2006)
Zhou, X.G., Liu, G.X., Zhao, D.: The layout optimization of electronic components based on genetic algorithm. The Computer Engineering and Application 4(17), 100–103 (2007)
Qiu, L.F., Fang, B.Z., Lu, J.L.: The present situation and the demand of electronic information products’ adaptability to the environment. Electronic Product Reliability and Environmental Test 24(2), 66–69 (2006)
Yang, Y.Z., Xie, G.J.: The gate array layout based on simulated annealing algorithm. Microelectronics and Computer 27(4), 115–117, 121 (2010)
Sun, C.C., Lin, D.: The research of layout Based on sequence and the simulated annealing algorithm. Microelectronics and Computer 26(1), 210–213, 67 (2010)
Zhang, Y.P., Feng, Q.K., Yu, X.L.: The thermal analysis and design of multi-chip module (MCM). Power Electronics 43(2), 67–69 (2009)
Ankur, J., Robert, E.J., Huang, Z.H., et al.: Thermal Modeling and Design of 3D of Integrated Circuits. In: IEEE. Int. 2008:Thermal and Thermo-mechanical Phenomena in Electronic Systems, pp. 1139–1145. IEEE, USA (2008)
Huang, Y.F., Zhang, R.B., Ling, W.S.: The analysis of heat reliability of the key component on PCB board. Micro Computer Information 21(2), 164–166 (2005)
Qi, J.-Y.: Application of Improved Simulated Annealing Algorithm in the Facility Layout Design. In: Proceedings of the 29th of Chinese Control Conference, Beijing, China, July 29-31, pp. 5224–5227 (2010)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2012 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Tian, S., Su, Z., Ma, X., Zhao, X. (2012). Simulated Annealing Algorithm in the Application of Thermal Reliability. In: Xiao, T., Zhang, L., Fei, M. (eds) AsiaSim 2012. AsiaSim 2012. Communications in Computer and Information Science, vol 324. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-34390-2_39
Download citation
DOI: https://doi.org/10.1007/978-3-642-34390-2_39
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-34389-6
Online ISBN: 978-3-642-34390-2
eBook Packages: Computer ScienceComputer Science (R0)