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Simulated Annealing Algorithm in the Application of Thermal Reliability

  • Shaoxin Tian
  • Zhong Su
  • Xiaofei Ma
  • Xu Zhao
Conference paper
Part of the Communications in Computer and Information Science book series (CCIS, volume 324)

Abstract

According to the influence of temperature on the lifespan of electronic devices, this paper uses the simulated annealing algorithm to optimize the layout of array distributed electronic components, and the finite element method to verify the result. The results show that it can effectively lower the high temperature of the electronic components through the layout optimization. The highest temperature and the average temperature are decreased by 10.49% and 10.41% respectively in this simulation, which indicates the simulated annealing algorithm can effectively solve the problem of layout optimization of components on the printed circuit board and avoid large-scale computing in the traditional algorithm. This algorithm is of practical value in the field of engineering.

Keywords

simulated annealing algorithm array distribution finite element high temperature thermal layout optimization 

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Copyright information

© Springer-Verlag Berlin Heidelberg 2012

Authors and Affiliations

  • Shaoxin Tian
    • 1
  • Zhong Su
    • 1
  • Xiaofei Ma
    • 1
  • Xu Zhao
    • 1
  1. 1.Institute of Intelligence ControlBeijing Information Science & Technology UniversityBeijingChina

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