The Transient Temperature Field Measurement System for Laser Bonding Process

Abstract

Laser bonding technology is widely used in encapsulation field. However, the uneven temperature field in the laser bonding influences the bonding quality. This paper is to study the effect of temperature on the laser bonding quality. The designed system has a human-machine interface and its measurement accuracy reach±1^oC. The multiple temperature measurement system is developed for laser bonding process based on K-type thermocouple. This system is composed of a host computer by PC software Visual Basic 6.0 and a lower controller whose core is MSP430F149. The host computer is used for human-machine interface interaction, controlling the lower controller through serial communication protocol. According to the instructions from the host computer, the lower controller executes the corresponding temperature measurement action, and then survey data from multi-channel thermocouples is transferred to the host computer through a serial port. The temperature can be displayed curves and saved. This system has wider measuring temperature range, higher temperature measurement precision and high sensitivity and can meet the transient temperature field measurement need of laser bonding. The temperature measurement range of the system is 0 to 1000 ^oC and the measurement accuracy of the system reaches±1^oC using the single chip MSP430F149 with 12-bit ADC module.