Abstract
For the digital imaging system of solder joint defect detection of BGA device in the printed circuit board, the paper calculate the optimal imaging results by analyzing the effect of the ray source focal size on the imaging results. The superposition display of captured image achieves good real-time effects. By testing, the systemic resolution of optimal magnification achieves 17lp/mm, the minimum resolution of defect analysis accuracy achieves 0.03mm, and show the result picture of collection test.
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© 2012 Springer-Verlag Berlin Heidelberg
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Zhang, W., Zhang, X.L. (2012). BGA Device Detection System Based on Frame Integral Reducing Noise Method. In: Deng, W. (eds) Future Control and Automation. Lecture Notes in Electrical Engineering, vol 173. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-31003-4_43
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DOI: https://doi.org/10.1007/978-3-642-31003-4_43
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-31002-7
Online ISBN: 978-3-642-31003-4
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