Skip to main content

Design for Testability for Micro-mechatronic Systems

  • Conference paper
Smart Product Engineering

Part of the book series: Lecture Notes in Production Engineering ((LNPE))

  • 6828 Accesses

Abstract

The development and manufacturing of highly precise micro-mechatronic systems, such as MEMS applications, is a challenging task due to the complexity and variety of their manufacturing technologies, as well as their high quality requirements. Within the context of the product engineering process of micro-mechatronic systems, quality inspection by means of production measurement technology is a crucial factor. This paper presents a survey of the challenges regarding quality inspection of micro-mechatronic systems. Furthermore, a Design for Testability approach for these types of products is described and exemplary applications of its implementation are shown.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 259.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 329.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 329.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Schweitzer, G.: Mechatronik - Aufgaben und Lösungen. VDI-Berichte, vol. 787. VDI Verlag, Düsseldorf (1989)

    Google Scholar 

  2. Harashima, F., Tomizuka, M., Fukuda, T.: Mechatronics – “What Is It, Why, and How¿‘: An Editorial. IEEE/ASME Transactions on Mechatronics 1(1), 1–4 (1996)

    Google Scholar 

  3. Isermann, R.: Mechatronic systems, fundametals. Springer, London (2005)

    Google Scholar 

  4. Menz, W., Mohr, J., Paul, O.: Mikrosystemtechnik für Ingenieure. Wiley-VCH, Weinheim (2005)

    Google Scholar 

  5. Tummala, R.R., Swaminathan, M.: Introduction to System-on-Package (SOP): Miniaturization of the Entire System. McGraw-Hill, New York (2008)

    Google Scholar 

  6. Feldmann, K.: Technologie 3D-MID. Hanser, München (2004)

    Google Scholar 

  7. Fjelstad, J.: Flexible Circuit Technology, 3rd edn. BR Publishing, Seaside (2006)

    Google Scholar 

  8. Ehrenspiel, K.: Integrierte Produktentwicklung. Hanser, München (2007)

    Google Scholar 

  9. Verein Deutscher Ingenieure: VDI guideline 2206: Design methodology for mechatronic systems. Beuth, Berlin (2004)

    Google Scholar 

  10. Eversheim, W., Bochtler, W., Gräßler, R., Kölscheid, W.: Simultaneous engineering approach to an integrated design and process planning. European Journal of Operational Research 100, 327–337 (1997)

    Article  MATH  Google Scholar 

  11. Geiger, W., Kotte, W.: Handbuch Qualität, 4th edn. Vieweg, Wiesbaden (2005)

    Book  Google Scholar 

  12. Pahl, G., Beitz, W., Feldhusen, J., Grote, K.-H.: Konstruktionslehre: Grundlagen erfolgreicher Produktentwicklung: Methoden und Anwendung, 7th edn. Springer, Berlin (2007)

    Google Scholar 

  13. Wu, P.: Design for Testability. In: Seventh National Conference on Artificial Intelligence, pp. 358–363 (1988)

    Google Scholar 

  14. Noia, B., Chakrabarty, K.: Testing and Design-for-Testability Techniques for 3D Integrated Circuits. In: Twentieth Asian Test Symposium, pp. 474–479 (2011)

    Google Scholar 

  15. Weckenmann, A., Gawande, B.: Koordinatenmesstechnik: Flexible Messstrategien für Maß, Form und Lage. Hanser, München (1999)

    Google Scholar 

  16. Blank, T., Gemmeke, H., Kühner, T., Schlote-Holubek, K., Wüstling, S.: Von der Mikrokomponente zum System: Aufbau hybrider Mikrosysteme am IPE. In: 10th GMM Workshop “Methoden und Werkzeuge für den Entwurf von Mikrosystemen“ (2004)

    Google Scholar 

  17. Blank, T.: Test and Characterization of Omnidirectional Sensitive Micro Vibration Sensors. Mechatronik Tage Karlsruhe (2008)

    Google Scholar 

  18. Schlitzkus, M., Rohde, G.: MID Pressure Sensor for automotive application. In: 10th International Congress Molded Interconnect Devices (2012)

    Google Scholar 

  19. Marinissen, E.J., Zorian, Y.: Testing 3D Chips Containing Through-Silicon Vias. In: International Test Conference (2009)

    Google Scholar 

  20. Chakrabarty, K.: Testing of 3-D Stacking Devices. Tutorial. In: 21st IEEE North Atlantic Test Workshop (2012)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2013 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Lanza, G., Blank, T., Haefner, B. (2013). Design for Testability for Micro-mechatronic Systems. In: Abramovici, M., Stark, R. (eds) Smart Product Engineering. Lecture Notes in Production Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-30817-8_28

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-30817-8_28

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-30816-1

  • Online ISBN: 978-3-642-30817-8

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics