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3D Data Structures for Nanoscale Design

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Bio and Nano Packaging Techniques for Electron Devices

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Abstract

The silicon-scaling revolution presents a multitude of challenges as technology progresses into the nanoscale era. One of these challenges are new data structures required for nanoscale designs which are inherently three-dimensional (3D). The majority of the currently developed 3D data structures are extensions of their well known 2D predecessors. New data structures specifically designed for the 3D nanoscale designs—which are truly able to fulfill the new demand determined by 3D integration technologies—are required. In this paper a systematic overview of main data structures that have been developed for 3D designs is presented. Their characteristics are investigated in detail in order to draw conclusions about the application potential in the new, nanoscale 3D context.

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Notes

  1. 1.

    It is the same complexity class as 3D-subTCG but delivers a 15x speed up compared to 3D-subTCG when applied to the 3D-ami49 benchmark.

  2. 2.

    The original O(\(n^3\)) complexity was making the 3D-BSG practically unusable.

  3. 3.

    Measured in terms of effectiveness, i.e., volume ratio over simulated annealing time (faster and less white space). The comparison limited to a small number of boxes (100) and short search times (1000 s on a Pentium IV 3.2 GHz).

  4. 4.

    Two arbitrary solutions can be connected by a set of operations. Higher reachability means a lower number of required operations.

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Authors and Affiliations

  1. Institute of Electromechanical and Electronic Design, Technische Universität Dresden, 01062, Dresden, Germany

    Robert Fischbach

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  1. Robert Fischbach
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Editors and Affiliations

  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Fischbach, R. (2012). 3D Data Structures for Nanoscale Design. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_5

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