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Packaging for Electronic Systems

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Bio and Nano Packaging Techniques for Electron Devices
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Abstract

Electronic systems are systems comprising electronic devices, circuits and components which are designed to accomplish certain complex functions. Examples are cell phones, computers, electronic music systems like MP3 players, anti-lock braking systems (ABS), quartz watches, implantable cardiac pacemakers, and many others. Usually, electronic systems do not contain only electronic components like integrated circuits but also mechanical, optical and other ones providing functionalities far beyond of pure electronic devices. An often used term for such miniaturised systems is micro- or nano-opto-electro-mechanical systems (NOEMS, MOEMS or simply nano- or microsystems). To accomplish the complex functions of such systems packaging has to integrate the function components into a working system, has to maintain these system functions independently of ambient and operating conditions, and has to couple the system to its environment, e.g. the operator or costumer of the system.

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References

  1. Anantatmula, R.P., Johnson, A.A., Gupta, S.P., Horylev, R.J.: The gold-silicon phase diagram. J. Electron. Mater. 4(3), 445–463 (1975)

    Article  CAS  Google Scholar 

  2. Bardeen, J., Brittain, W.H.: The transistor, a semiconductor triode. Phys. Rev. 74, 230 (1948)

    Article  Google Scholar 

  3. Becker, E.W., Ehrfeld, W., Hagmann, P., Maner, A., Münchmeyer, D.: Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron. Eng. 4(1), 35–56 (1986)

    Article  CAS  Google Scholar 

  4. Bernt, N., Tummala, R.R.: Method of Manufacturing a Multi-Layered Glass-Ceramic Package for the Mounting of Semiconductor Devices. Patent US 4,221,047 (September 9, 1980)

    Google Scholar 

  5. Boone, G.: Computing Systems CPU. Patent US 3,757,306 (September 4, 1973)

    Google Scholar 

  6. Dennard, R.H.: Field-Effect Transistor Memory. Patent US 3,387,286 (June 4, 1968)

    Google Scholar 

  7. Dummer. http://www.epn-online.com/page/22909/the-hapless-tale-of-geoffrey-dummer-this-is-the-sad-.html

  8. Eisler, P.: My Life with the Printed Circuit. Lehigh University Press, Bethlehem (1989)

    Google Scholar 

  9. Eloy, J.C.: Status of the MEMS industry in 2006. Sens. Transducers Mag. (S&T e-Digest) 66(4), 521–525 (2006)

    Google Scholar 

  10. Esahi, M.: Encasulated micromechanical sensors. Microsyst. Technol. 1(1), 2–9 (1994)

    Article  Google Scholar 

  11. Fan, L.S., Tai, Y.C., Muller, R.S.: Pin joints, gears, springs, cranks, and other novel micromechanical structures. In: Proceedings of the 4th International Conference on Solid-State Sensors and Actuators (Transducers 87), p. 853–856. Tokyo, Japan (1987)

    Google Scholar 

  12. Finne, R.M., Klein, D.L.: A water-amine-complexing agent system for etching silicon. J. Electrochem. Soc. 114, 965–970 (1967)

    Article  CAS  Google Scholar 

  13. Gabriel, K.J., Trimmer, W.S.N., Mehregany, M.: Micro gears and turbines etched from silicon. In: Proceedings of the 4th International Conference on Solid-State Sensors and Actuators (Transducers 87), p. 857–860. Tokyo, Japan (1987)

    Google Scholar 

  14. Garrou, P., Bower, C., Ramm, P.: Handbook of 3D Integration, vol. 3. Wiley-VCH, Weinheim (2008)

    Book  Google Scholar 

  15. Gerlach, G., Dötzel, W.: Introduction to Microsystem Technology. A Guide for Students. Wiley, Chichester (2008)

    Google Scholar 

  16. Gerlach, G., Werthschützky, R.: 50 Jahre Entdeckung des piezoresistiven Effekts, Geschichte und Entwicklung piezoresistiver Sensoren. Technisches Messen 72(2), 53–76 (2005)

    Article  Google Scholar 

  17. Gerlach, G., Werthschützky, R.: 50 years of piezoresistive sensors. History and state of the art in piezoresistive sensor technology. In: 12th International Conference Sensor 2005, vol. 1, pp. 11–16. Nürnberg (2005)

    Google Scholar 

  18. Hornbeck, L.: Current status of the digital mirror device (DMD) for projection television applications. IEDM Tech. Dig. pp. 381–384 (1993)

    Google Scholar 

  19. Hsu, T.R.: Packaging design of microsystems and meso-scale devices. IEEE Trans. Adv. Packag. 23(4), 596–601 (2000)

    Article  Google Scholar 

  20. Hugle, F.: Automated packaging of semiconductors. Patent US 3,440,027 (April 22, 1969)

    Google Scholar 

  21. Jacobi, W.: Halbleiterverstärker. Patent DE 833,366 (May 15, 1952)

    Google Scholar 

  22. Khanna, P.K., Bhatnagar, S.K., Gust, W.: Analysis of packaging and sealing techniques for microelectronic modules and recent advances. Microelectronics International 16(2), 8–12 (1999)

    Article  CAS  Google Scholar 

  23. Kilby, J.S.: Miniaturized electronic circuits. Patent US 3,138,743 (June 23, 1964)

    Google Scholar 

  24. Ko, W.H.: Packaging of microfabricated devices and systems. Mater. Chem. Phys. 42, 169–175 (1995)

    Article  CAS  Google Scholar 

  25. Ko, W.H., Spears, T.M.: Packaging materials and techniques for implantable instruments. Eng. Med. Biol. Mag. 2(1), 24–38 (1983)

    Article  Google Scholar 

  26. Ko, W.H.: Suminto. Micromachining and Micropackaging for Transducers. Elsevier, J.T. (1985)

    Google Scholar 

  27. Kotnik, J.T., Hamilton, J.H.: Pressure transmitter employing a diffused silicon sensor. IEEE Trans. Ind. Electron. 17(4), 285–291 (1970)

    Article  Google Scholar 

  28. Kovacs, G.T.A., et al : Micromachined Transducers Sourcebook. WCB/McGraw-Hill, Boston (1998)

    Google Scholar 

  29. Lärmer, F., Schilp, A.: Verfahren zum anisotropen Ätzen von Silicium. Patent DE 4,241,045 (May 26, 1994)

    Google Scholar 

  30. Lau, J.H. et al (ed.): Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies. McGraw-Hill, Boston (1995)

    Google Scholar 

  31. Lau, J.H. (ed.): Flip Chip Technologies. McGraw-Hill, Boston (1996)

    Google Scholar 

  32. Lehovec, K.: Multiple semiconductor assembly. Patent US 3,029,366 (April 10, 1962)

    Google Scholar 

  33. Lilienfeld, J.E.: Method and apparatus for controlling electric current. Patent US 1,745,175 (January 28, 1930)

    Google Scholar 

  34. Lu, D., Wong, C.P. (eds.): Materials for Advanced Packaging. Springer, New York (2009)

    Google Scholar 

  35. Mackay, C.A., Levine, S.W.: Solder sealing semiconductor packages. IEEE Trans. Compon. Hybr. 9(2), 195–201 (1986)

    Article  Google Scholar 

  36. Mallon, J.R.: Fiftieth birthday of piezoresistive sensing: progenitor to MEMS. http://www.rgrace.com/Conferences/detroit04xtra/mems/memvent.doc

  37. Massey, L.K.: Permeability Properties of Plastics and Elastomers–A Guide to Packaging and Barrier Materials, 2nd edn. William Andrew Publishing/Plastics Design Library, New York (2003)

    Google Scholar 

  38. Moore, G.E.: Cramming more components onto integrated circuits. Electronics 38(8), 5–7 (1965)

    Google Scholar 

  39. MST: Fun& recreation with microsystems. MST news 3 (2006)

    Google Scholar 

  40. Najafi, K.: Micropackaging technologies for integrated microsystems: application to MEMS and MOEMS. In: J. Yasaitis, M. Perez-Maher, J. Karam (eds.) Micromachining and Microfabrication Process Technology VIII. Proceedings of SPIE 4979, 1–19 (2003)

    Google Scholar 

  41. Nakladal, A., Sager, K., Gerlach, G.: Influences of humidity and moisture on the long-term stability of piezoresistive pressure sensors. Measurement 16, 21–29 (1995)

    Article  Google Scholar 

  42. Nathanson, H.C., Wickstrom, R.A.: A resonant gate silicon surface transistor with high-Q band-pass properties. Appl. Phys. Lett. 7(4), 84–86 (1965)

    Article  Google Scholar 

  43. Noyce, R.: Semicinductor circuit complex having isolation means. Patent US 3,150,299 (February 22, 1964)

    Google Scholar 

  44. Peake, E.R., et al.: Solid-state digital pressure transducer. IEEE Trans. Electron Devices 16, 870–876 (1969)

    Article  Google Scholar 

  45. Pecht, M.: Intgrated Circuit, Hybrid and Multichip Module Package Design Guidelines: a Focus on Reliability. Wiley, New York (1994)

    Google Scholar 

  46. Pomerantz, D.I.: Anodic bonding. Patent US 3,397,278 (August 13, 1968)

    Google Scholar 

  47. Rai-Choudhury, P. (ed.): MEMS and MOEMS Technology and Applications. SPIE Press, Bellingham (2000)

    Google Scholar 

  48. Rogers, B.: How Fairchild makes its new face-down bonded microchips. Insulation 11, 48–51 (1967)

    Google Scholar 

  49. Roylance, L.M., Angell, J.B.: A batch-fabricated silicon accelerometer. IEEE Trans. Electron Devices 26(12), 1911–1917 (1979)

    Article  Google Scholar 

  50. Salomon, P., Bazu, M., van Heeren, H., Lavu, S., Bunyan, J., Desmulliez, M.: The reliability of micro and nano systems. MST news 4, 20–22 (2008)

    Google Scholar 

  51. Scheel, W. (ed.): Baugruppentechnologie der Elektronik: Montage. Verlag Technik and Eugen G. Lenze Verlag, Berlin and Saulgau (1997)

    Google Scholar 

  52. SCHOTT: Hermetic packaging and sealing technology. Tech. rep., SCHOTT (September 14, 2010). http://www.schott.com/epackaging/english/download/ep_brochure_2009_engl.pdf

  53. SEMI: http://www.semi.org

  54. Sergent, J.E., Krum, A.: Thermal Management Handbook for Electronic Assemblies. McGraw-Hill, Boston (1998)

    Google Scholar 

  55. Shaw, K.A., Zhang, Z.L., MacDonald, N.C.: SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structure. Sens. Actuators, A 40, 63–70 (1994)

    Google Scholar 

  56. Shimbo, M., Furukawa, K., Fukuda, K., Tanzawa, K.: Silicon-to-silicon direct bonding method. J. Appl. Phys. 68, 2987–2989 (1986)

    Google Scholar 

  57. Shockley, W.: Semiconductor amplifier. Patent US 2,502,488 (April 4, 1950)

    Google Scholar 

  58. Shockley, W., Bardeen, J., Brattain, W.H.: Electronic theory of the transistor. Science 108, 678–679 (1948)

    Google Scholar 

  59. Smith, C.S.: Piezoresistance effect in germanium and silicon. Phys. Rev. 94, 42–49 (1954)

    Article  CAS  Google Scholar 

  60. Strong, H.V., Eisler, P.: Manufacture of electric circuits and circuit components. Patent US 639,111 (February 10, 1950)

    Google Scholar 

  61. Terry, S.C., Jerman, J.H., Angell, J.B.: A gas chromatographic air analyzer fabricated on a silicon wafer. IEEE Trans. Electron Devices 26(12), 1880–1886 (1979)

    Article  Google Scholar 

  62. Tufte, O.N., Chapman, P.W., Long, D.: Silicon diffused-element piezoresistive diaphragms. J. Appl. Phys. 33(11), 3322–3327 (1962)

    Article  Google Scholar 

  63. Tummala, R. (ed.): Fundamentals of Microsystems Packaging. McGraw-Hill, New York (2001)

    Google Scholar 

  64. Tummala, R.R., Rymaszewski, E.J., Klopfenstein, A.G. (eds.): Microelectronics Packaging Handbook, 2. edn. Chapman& Hall, New York (1996)

    Google Scholar 

  65. Waggener, H.A.: Electrochemically controlled thinning of silicon. Bell System Tech. J. 50, 473–475 (1970)

    Google Scholar 

  66. Wybransky, B.: Standards and roadmaps in MST. MST news 2, 45–46 (2006)

    Google Scholar 

  67. Yurish, S.Y., Kirianaki, N.V., Myshkin, I.L.: World sensors and MEMS markets: analysis and trends. Sensors& Transducers Magazine (S&T e-Digest) 62 (2005)

    Google Scholar 

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Gerlach, G. (2012). Packaging for Electronic Systems. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_1

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