Abstract
A water-cooling radiator is the effective heat dissipation device to ensure the high-power electrical equipment work properly and the heat transfer process and thermal deformation of the water-cooling radiator become hot research areas currently. Based on a water-cooling radiator of a company, the simulation model for its single water-cooling flow channel is established and the influence of the flow velocity of the inlet fluid and thermal convection of air on the outlet temperature of fluid is analyzed by the commercial software ANSYS. In addition, the thermal deformation of the water-cooling flow channel is discussed. The simulation results show that the outlet temperature declines progressively as the inlet velocity increases, the outlet temperature goes downlinearly with the increase of coefficient of air convection. And the thermal deformation of the brass water-cooling radiator is obviously non-uniform and becomes warp inevitably.
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References
Liu, R.: Analytical and experimental study on the comprehensive performance of plate fin and staggered heat sinks. Tianjin University of Science and Technology (2006)
Sun, S., Zhang, H.: Analysis of CFD simulation with experiment of heat transfer and pressure drop for heat pipe heat exchanger. Journal of Nanjing University of Technology, Science 2, 62–65 (2004)
Zhou, M., Wu, S.: Forced Air Cooling Simulation of an Electronic Supply. Computer Engineering, Science 9, 171–172 (2003)
Zhi, M., Liu, Y.: Numerical simulation of electric power and electronic equipment radiator. North China Electric Power University (2006)
Guo, C., Zhou, J.: Numerical analysis of the thermal stress induced by temperature differences of fixed tube-sheet heat exchangers. Chemical Machinery, Science 1, 41–46 (2009)
Xiao, S.S.: The latest classic ANSYS and Workbench tutorial, p. 1. Publishing house of electronic industry, China (2004)
Xu, Y., Dang, S.: Example Guide to flow analysis by ANSYS 11.0/FLOTRAN, p. 82. China machine press (2009)
Zhang, X., Ren, Z.: Heat transfer (fourth version), p. 102. China Building Industry Press, Beijing (2001)
ANSYS, Realse 10.0 Documentation for ANSYS
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© 2012 Springer-Verlag GmbH Berlin Heidelberg
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Lianfa, Y., Qin, W., Zhen, Z. (2012). The Analysis of Thermal Field and Thermal Deformation of a Water-Cooling Radiator by Finite Element Simulation. In: Lee, G. (eds) Advances in Intelligent Systems. Advances in Intelligent and Soft Computing, vol 138. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-27869-3_7
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DOI: https://doi.org/10.1007/978-3-642-27869-3_7
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-27868-6
Online ISBN: 978-3-642-27869-3
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