Abstract
The conventional photodiode, available in every CMOS process as a PN junction, can be enriched by smart electronics and therefore achieve interesting performance in the implementation of 3D Time-Of-Flight imagers. The high level of integration of deep submicron technologies allows the realization of 3D pixels with interesting features while keeping reasonable fill-factors.
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Perenzoni, M., Kostov, P., Davidovic, M., Zach, G., Zimmermann, H. (2013). Electronics-Based 3D Sensors. In: Remondino, F., Stoppa, D. (eds) TOF Range-Imaging Cameras. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-27523-4_3
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DOI: https://doi.org/10.1007/978-3-642-27523-4_3
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