Abstract
In the DIP devices’ quick release system’s design, the temperature adjustment of the solder is needed to protect the circuit. In this paper, a intellective temperature control and measure system is designed, which is based on the STM32 series micro-controllers. The structure of the system’s hardware is introduced detailed. For the Fuzzy-PID temperature control strategy, the system can adjust the temperature of the solder accurately.
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© 2011 Springer-Verlag Berlin Heidelberg
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Kong, X., Wang, C., Sun, S. (2011). Design of Temperature Measuring and Controlling System Based on STM32. In: Yang, D. (eds) Informatics in Control, Automation and Robotics. Lecture Notes in Electrical Engineering, vol 133. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25992-0_36
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DOI: https://doi.org/10.1007/978-3-642-25992-0_36
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-25991-3
Online ISBN: 978-3-642-25992-0
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