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Visual ACFM Inspection System for Defect Based on Labview

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Recent Advances in Computer Science and Information Engineering

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 128))

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Abstract

In order to realize the ACFM detection signal visualization, based on the unique functions of numerical analysis, image display and programming of Labview software, using the mutual correlation principle and A/D data acquisition card USB5935, has established the ACFM flaw visualization examination system. This system can realize the functions of data acquisition, signal processing and the image display, which had the very strong inhibitory action to the noise and successfully has realized the test visualization.

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References

  1. Saguy, H., et al.: Flaw detection in metals by the ACPD technique: Theory and experiments. NDT and E International 40(7), 505–509 (2007)

    Article  Google Scholar 

  2. Ren, S., Zhu, Z., Lin, T., Song, K., Ren, J.: Design for the ACFM Sensor and the Signal Processing Based on Wavelet Denoise. In: 2009 2nd International Congress on Image and Signal Processing (CISP 2009). IEEE Press (2009)

    Google Scholar 

  3. Smith, M., et al.: The detection of pipeline SCC flaws using the ACFM technique. Non-Destructive Testing and Condition Monitoring 47(12), 765–768 (2005)

    Article  Google Scholar 

  4. Knight, M.J., et al.: Effect of residual stress on ACFM crack measurements in drill collar threaded connections. NDT & E International 37(5), 337–343 (2004)

    Article  MathSciNet  Google Scholar 

  5. Hoshikawa, H., Koyama, K.: Basic study of a new ECT using uniform rotating direction eddy current. Review of Progress in Quantitative Nondestructive Evaluation. Review of Progress in QNDE (16A), 1067 (1997)

    Google Scholar 

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Authors and Affiliations

  1. Key Lab of Nondestructive Testing, Nanchang Hangkong University, Fenghe South Road No.696, Nanchang, 330063, China

    Ren Shang-kun, Li Zhong-ji & Yang Yao

Authors
  1. Ren Shang-kun
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  2. Li Zhong-ji
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  3. Yang Yao
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Corresponding author

Correspondence to Ren Shang-kun .

Editor information

Editors and Affiliations

  1. , College of Communication Engineering, Jilin University, Room 313, Building No.1, Changchun, Nanhu Avenue 5372, Jilin, 130012, China, People's Republic

    Zhihong Qian

  2. , Department of Electrical Engineering, The University of Mississippi, Anderson Hall 314, Mississippi, 38677, Mississippi, USA

    Lei Cao

  3. , Department of Electrical and Computer En, Naval Postgraduate School, Rm. 452 Spanagel Bldg. 232, Dyer Road 833, Monterey, 93943-5121, California, USA

    Weilian Su

  4. , Faculty of Computing, London Metropolitan University, Holloway Road 166-220, London, N7 8DB, United Kingdom

    Tingkai Wang

  5. , College of Software, Changchun University of Science and Tech, Changchun, Jilin, 130022, China, People's Republic

    Huamin Yang

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© 2012 Springer-Verlag GmbH Berlin Heidelberg

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Shang-kun, R., Zhong-ji, L., Yao, Y. (2012). Visual ACFM Inspection System for Defect Based on Labview. In: Qian, Z., Cao, L., Su, W., Wang, T., Yang, H. (eds) Recent Advances in Computer Science and Information Engineering. Lecture Notes in Electrical Engineering, vol 128. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25792-6_84

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  • DOI: https://doi.org/10.1007/978-3-642-25792-6_84

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-25791-9

  • Online ISBN: 978-3-642-25792-6

  • eBook Packages: EngineeringEngineering (R0)

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