Abstract
Nanoimprint lithography (NIL) is a technology that allows the fabrication of low-cost nanostructure devices at high throughput and accuracy. The most popular NIL method is ultraviolet (UV) nanoimprinting because it is a room-temperature process that does not require a thermal cycle. When demolding, the force required is the result of adhesion and friction between the antisticking layer and the resin, and a high demolding force produces pattern defects. Scanning probe microscopy (SPM) is a useful technique for evaluating the performance at the nanometer scale of both the antisticking layer and the UV-curable resin. In this chapter, we describe the evaluation, using techniques of scanning probe microscopy, of a number of properties of antisticking layers and UV-curable resins used in nanoimprint lithography.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
S.Y. Chou, P.R. Krauss, P.J. Renstrom, Appl. Phys. Lett. 67, 3114–3116 (1995)
S.Y. Chou, P.R. Krauss, P.J. Renstrom, Science 272, 85–87 (1996)
S.Y. Chou, P.R. Krauss, W. Zhang, L. Guo, L. Zhuang, J. Vac. Sci. Technol. B 15, 2897–2904 (1997)
A. Fuchs, M. Bender, U. Plachetka, L. Kock, T. Wahlbrink, H. Gottlob, J. Efavi, M. Moeller, M. Schmidt, T. Mollenhauer, C. Moormann, M. Lemme, H. Kurz, J. Vac. Sci. Technol. B24, 2964–2967 (2006)
S. Yoshitake, H. Sunaoshi, K. Yasui, H. Kobayashi, T. Sato, O. Nagarekawa, E. Thompson, G. Schmid, J. Resnick, in Photomask Technology 2007 Proceedings of SPIE, vol. 6730, Monterey, 2007, p. 67300E
G.M. Schmid, M.D. Stewart, J. Wetzel, F. Palmieri, J. Hao, Y. Nihimura, K. Jen, E.K. Kim, D.J. Resnick, J.A. Liddle, C.G. Willson, J. Vac. Sci. Technol. B24, 1283–1291 (2006)
M. Beck, F. Persson, P. Carlberg, M. Graczyk, I. Maximov, T.G.I. Ling, L. Montelius, Microelectron. Eng. 73–74, 837–842 (2004)
S. Nomura, H. Kojima, Y. Ohyabu, K. Kuwabara, A. Miyauchi, T. Uemura, Jpn. J. Appl. Phys. Part 2 44, L1184–L1186 (2005)
M.S. Kim, J.S. Kim, J.C. Cho, M. Shtein, L.J. Guo, J. Kim, Appl. Phys. Lett. 90, 123113-1–123113-3 (2007)
J. Haisma, M. Verheijen, K.V.D. Heuvel, J. Vac. Sci. Technol. B 14,4124–4128 (1996)
T. Bailey, B.J. Choi, M. Colburn, M. Meissi, S. Shaya, J.G. Ekerdt, S.V. Sreenivasan, C.G. Willson, J. Vac. Sci. Technol. B 18, 3572–3577 (2000)
M. Komuro, J. Taniguchi, S. Inoue, N. Kimura, Y. Tokano, H. Hiroshima, S. Matsui, Jpn. J. Appl. Phys. 39, 7075–7079 (2000)
S. Matsui, Y. Igaku, H. Ishigaki, J. Fujita, N. Ishida, Y. Ochiai, M. Komuro, H. Hiroshima, J. Vac. Sci. Technol. B 19, 2801–2805 (2001)
S. Matsui, Y. Igaku, H. Ishigaki, J. Fujita, N. Ishida, Y. Ochiai, H. Namatsu, M. Komuro, H. Hiroshima, J. Vac. Sci. Technol. B 21, 688–692 (2003)
K. Nakamatsu, K. Watanabe, K. Tone, T. Katase, W. Hattori, Y. Ochiai, T. Matsuo, M. Sasago, H. Namatsu, M. Komuro, S. Matsui, Jpn. J. Appl. Phys. 43, 4050–4053 (2004)
K. Nakamatsu, K. Watanabe, K. Tone, H. Namatsu, S. Matsui, J. Vac. Sci. Technol. B 23, 507–512 (2005)
G. Binning, C.F. Quate, C.H. Gerber, Phys. Rev. Lett. 56, 930–933 (1986)
N.A. Burham, R.J. Colton, J. Vac. Sci. Technol. A 7, 2906–2913 (1989)
C.M. Mate, M.R. Lorenz, V.J. Novotny, J. Chem. Phys. 90, 7550–7555 (1989)
A. Koszewski, Z. Rymuza, F. Reuther, Microelectron. Eng. 85, 1189–1192 (2008)
C.M. Mate, G.M. McClelland, R. Erlandsson, S. Chiang, Phys. Rev. Lett. 59, 1942–1945 (1987)
R. Erlandsson, G. Hadziioannou, C.M. Mate, G.M. McClelland, S. Chiang, J. Chem. Phys. 89, 5190–5193 (1988)
A. Takahara, X. Jiang, N. Satomi, K. Tanaka, T. Kajiyama, Key Eng. Mater. 137, 79–86 (1998)
Y. Hirai, S. Yoshida, A. Okamoto, Y. Tanaka, M. Endo, S. Irie, H. Nakagawa, M. Sasago, J. Photopolym. Sci. Technol. 14, 457–462 (2001)
S.W. Ahn, K.D. Lee, J.S. Kim, S.H. Kim, J.D. Park, S.H. Lee, P.W. Yoon, Nanotechnology 16, 1874–1877 (2005)
J. Taniguchi, Y. Kamiya, T. Ohsaki, N. Saka, Microelectron. Eng. 87, 859–863 (2010)
M. Okada, K. Kuramoto, M. Iwasa, Y. Haruyama, S. Matsui, in Abstract P-LITHO-003 of 37th International Conference on Micro and Nano Engineering (MNE ‘11), Berlin, 19–23 September 2011
M. Okada, Y. Haruyama, K. Kanda, S. Matsui, J. Vac. Sci. Technol. B 29, 06FC09-1-06FC09-5 (2011)
J.V. Crivello, in Proceedings of SPE Regional Technical Conference on Photopolymers, Principles, Process and Materials, Ellenville, 8–10 November 1982, p. 267
F. Xu, N. Stacey, M. Watts, V. Truskett, I. McMackin, J. Choi, P. Schumaker, E. Thompson, D. Babbs, S.V. Sreenivasan, C.G. Willson, N. Schumaker, in Proceedings of SPIE Microlithography, vol. 5374, 2004 pp. 232–241
C. Decker, T.N.T. Viet, H.P. Thi, Polym. Int. 50, 986–997 (2001)
K. Tsunozaki, Y. Kawaguchi, Microelectron. Eng. 86, 694–696 (2009)
M. Vogler, H. Atasoy, C. Spreu, H. Schift, M. Zelsmann, F. Schlachter, F. Reuther, G. Grützner, in Abstract P-42 of 8th International Conference on Nanoimprint and Nanoprint Technology (NNT ‘09), San Jose, 11–13 November 2009
K. Wu, X. Wang, E.K. Kim, C.G. Willson, J.G. Ekerdt, Langmuir 23, 1166–1170 (2007)
M. Zelsmann, C. Alleaume, D. Truffier-Boutry, A. Francone, A. Beaurain, B. Pelissier, J. Boussey, Microelectron. Eng. 87, 1029–1032 (2010)
M. Okada, Y. Haruyama, S. Matsui, H. Miyake, S. Iyoshi, T. Yukawa, H. Takeuchi, J. Vac. Sci. Technol. B 29, 06FC04-1–06FC04-4 (2011)
M. Shibata, A. Horiba, Y. Nagaoka, H. Kawata, M. Yasuda, Y. Hirai, J. Vac. Sci. Technol. B 28, C6M108–C6M113 (2010)
T. Tanabe, N. Fujii, M. Matsue, H. Kawata, Y. Hirai, J. Vac. Sci. Technol. B 28, 1239–1241 (2010)
M. Okada, M. Iwasa, Y. Haruyama, K. Kanda, Y. Hirai, S. Matsu, in Proceedings of RadTech Asia 2011, Yokohama, 2010, pp. S1–11
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2012 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Okada, M., Matsui, S. (2012). Evaluation of the Nanoimprinting Process Using Scanning Probe Microscopy (SPM). In: Bhushan, B. (eds) Scanning Probe Microscopy in Nanoscience and Nanotechnology 3. NanoScience and Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25414-7_18
Download citation
DOI: https://doi.org/10.1007/978-3-642-25414-7_18
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-25413-0
Online ISBN: 978-3-642-25414-7
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)