Abstract
This chapter discusses and analyzes the bonding of OEIC and its electrical and thermal environment. First, the bonding interface between the OEIC and the heat sink would be investigated. In the following, failure mechanisms and reliability tests are discussed. Adhesive bonding takes more and more place in the electrical packaging especially for flexfoil and thermal sensitive chips. An overview of different gluing mechanisms is given. Finally, the different types of wire bonding techniques are depicted and compared in conjunction with practical examples for the application with RF connections.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Reichel, H.: Lecture script Microsystems Technology II, p. 120. Technical University of Berlin, Berlin (1999)
Kuhmann, J.F.: Untersuchungen zu einer flußmittelfreien und selbstjustierenden Flip-Bondtechnologie für photonische Komponenten. Ph.D. Thesis, TU-Berlin (1996)
Mickelsen, A.R., Basavanhally, N., Lee, Y.-C.: Optoelectronic Packaging, p. 2612. Wiley, New York (1997)
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2015 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Fischer-Hirchert, U.H.P. (2015). Soldering, Adhesive Bonding, and Bonding. In: Photonic Packaging Sourcebook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25376-8_6
Download citation
DOI: https://doi.org/10.1007/978-3-642-25376-8_6
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-25375-1
Online ISBN: 978-3-642-25376-8
eBook Packages: EngineeringEngineering (R0)