Abstract
This chapter discusses and analyzes the bonding of OEIC and its electrical and thermal environment. First, the bonding interface between the OEIC and the heat sink would be investigated. In the following, failure mechanisms and reliability tests are discussed. Adhesive bonding takes more and more place in the electrical packaging especially for flexfoil and thermal sensitive chips. An overview of different gluing mechanisms is given. Finally, the different types of wire bonding techniques are depicted and compared in conjunction with practical examples for the application with RF connections.
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References
Reichel, H.: Lecture script Microsystems Technology II, p. 120. Technical University of Berlin, Berlin (1999)
Kuhmann, J.F.: Untersuchungen zu einer flußmittelfreien und selbstjustierenden Flip-Bondtechnologie für photonische Komponenten. Ph.D. Thesis, TU-Berlin (1996)
Mickelsen, A.R., Basavanhally, N., Lee, Y.-C.: Optoelectronic Packaging, p. 2612. Wiley, New York (1997)
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© 2015 Springer-Verlag Berlin Heidelberg
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Fischer-Hirchert, U.H.P. (2015). Soldering, Adhesive Bonding, and Bonding. In: Photonic Packaging Sourcebook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25376-8_6
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DOI: https://doi.org/10.1007/978-3-642-25376-8_6
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Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-25375-1
Online ISBN: 978-3-642-25376-8
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