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3D-OSSDL: Three Dimensional Optimum Space Step Distance Localization Scheme in Stereo Wireless Sensor Networks

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Proceedings of the 2011 International Conference on Informatics, Cybernetics, and Computer Engineering (ICCE2011) November 19–20, 2011, Melbourne, Australia

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 112))

Abstract

Three-dimensional node localization is still a crucial and challenging problem in Wireless Sensor Networks (WSNs). In this paper, a range free three dimensional optimum space step distance localization scheme (3D-OSSDL) is proposed by analyzing classic two dimensional DV-Hop propagation algorithm. In 3D network model, all nodes are randomly deployed in space and forms arbitrary network parameters. By optimizing distances from the network model, the optimum space step distance from nodes to anchors is obtained and the coordinates of all unknown nodes are derived finally. The proposed 3D-OSSDL achieves higher accuracy than classic DV-Hop propagation algorithm by 20%-30% typically and decreases communication overhead of the network. The simulation results proved our theoretical analysis.

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Authors and Affiliations

  1. School of Information Science and Engineering, Shandong University, Jinan, 250100, China

    Yang Liu, Jianping Xing & Ran Wang

Authors
  1. Yang Liu
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  2. Jianping Xing
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  3. Ran Wang
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Editors and Affiliations

  1. South China Normal University, Yifeng Dasha Building C 1707 Huang Pu Da Dao Zhong Cui Yuan Jie 8, 510000, Tian He Qu, Guangzhou, China

    Liangzhong Jiang

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© 2011 Springer-Verlag Berlin Heidelberg

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Liu, Y., Xing, J., Wang, R. (2011). 3D-OSSDL: Three Dimensional Optimum Space Step Distance Localization Scheme in Stereo Wireless Sensor Networks. In: Jiang, L. (eds) Proceedings of the 2011 International Conference on Informatics, Cybernetics, and Computer Engineering (ICCE2011) November 19–20, 2011, Melbourne, Australia. Advances in Intelligent and Soft Computing, vol 112. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25194-8_3

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  • DOI: https://doi.org/10.1007/978-3-642-25194-8_3

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-25193-1

  • Online ISBN: 978-3-642-25194-8

  • eBook Packages: EngineeringEngineering (R0)

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