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A General Throughput Model for Parallel Cluster Tools

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Proceedings of the 2011 International Conference on Informatics, Cybernetics, and Computer Engineering (ICCE2011) November 19-20, 2011, Melbourne, Australia

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 110))

Abstract

To effectively evaluate and analyze performance of cluster tools in semiconductor manufacturing, the paper presents a throughput model for parallel cluster tools .For developping this model, the timing diagram is applied to describe the usage of the chamber and robot in parallel processing of cluster tools. Finally, the theoretical model which indicates the relationship between the number of chamber, processing time, transport time, and throughtput is deduced. This model can analyze and computer the wafer period and the batch period fast and accurately.

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References

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Author information

Authors and Affiliations

  1. Key Laboratory of Industrial Informatics, Shenyang Institute of Automation, CAS, Shenyang, 110016, China

    Zheng Xiuhong, Yu Haibin & Hu Jingtao

  2. Graduate School of the Chinese Academy of Sciences, CAS, Beijing, 100039, China

    Zheng Xiuhong & Hu Jingtao

  3. School of Computer Science and Technology, Shenyang Institute of Chemical Technology, Shenyang, 110142, China

    Zheng Xiuhong

Authors
  1. Zheng Xiuhong
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  2. Yu Haibin
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  3. Hu Jingtao
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Editor information

Editors and Affiliations

  1. South China Normal University, Yifeng Dasha Building C 1707, Huang Pu Da Dao Zhong, Cui Yuan Jie 8, Tian He Qu, 510000, Guangzhou, China

    Liangzhong Jiang

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© 2011 Springer-Verlag Berlin Heidelberg

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Xiuhong, Z., Haibin, Y., Jingtao, H. (2011). A General Throughput Model for Parallel Cluster Tools. In: Jiang, L. (eds) Proceedings of the 2011 International Conference on Informatics, Cybernetics, and Computer Engineering (ICCE2011) November 19-20, 2011, Melbourne, Australia. Advances in Intelligent and Soft Computing, vol 110. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-25185-6_29

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  • DOI: https://doi.org/10.1007/978-3-642-25185-6_29

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-25184-9

  • Online ISBN: 978-3-642-25185-6

  • eBook Packages: EngineeringEngineering (R0)

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