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Taguchi Method Optimization for PCB Lamination Process

  • Conference paper
Next Wave in Robotics (FIRA 2011)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 212))

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Abstract

The lamination process of Printed Circuit Board (PCB) is a complex engineering system. Because there are many factors and uncertainties in the process system, it’s hard for the optimization of successful lamination ratio. In this paper, the Taguchi method for lamination process optimization is proposed. Based on fundamental analysis, the major factors including board temperature, lamination temperature, lamination press, and lamination time are figured out. From the scale level of the major factors, orthogonal arrays L18 are engaged for the Taguchi experiments. Based on the orthogonal arrays L18 of the Taguchi experiments, the best successful ratio is analyzed to select the level of major factors. The selected level does again Taguchi experiment to improve the successful ratio. Experiment results show that the successful ratio improves very well.

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Author information

Authors and Affiliations

  1. Institute of System Information and Control, National Kaohsiung First University of Science and Technology, 2 Juoyue Road, Nantsu, Kaohsiung City, R.O.C.

    Kuo-Yang Tu & Min-Hui Li

Authors
  1. Kuo-Yang Tu
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  2. Min-Hui Li
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Editor information

Editors and Affiliations

  1. Department of Electrical Engineering, National Cheng Kung University, No. 1, University Road, 701, Tainan City, Taiwan

    Tzuu-Hseng S. Li

  2. National Kaohsiung First University of Science and Technology, 2 Juoyue Road, 40227, Taichung, Taiwan

    Kuo-Yang Tu

  3. Department of Electrical Engineering, Nationan Chung Hsing University, No. 250, Kuo-Kuang Road, 40227, Taichung, Taiwan

    Ching-Chih Tsai

  4. Department of Applied Electronics Technology, National Taiwan Normal University, 162 He-Ping East Road, Section 1, 10610, Taipei, Taiwan

    Chen-Chien Hsu

  5. National Kaohsiung First University of Science and Technology, 2 Juoyue Road, Nantsu District, 811, Kaohsiung City, Taiwan

    Chien-Cheng Tseng

  6. National University of Singapore, Singapore

    Prahlad Vadakkepat

  7. Department of Computer Science,, University of Manitoba, R3T 2N2, Winnipeg, Manitoba, Canada

    Jacky Baltes

  8. Department of Computer Science, University of Manitoba, R3T 2N2, Winnipeg, Manitoba, Canada

    John Anderson

  9. Tamkang University, Taipei, Taiwan

    Ching-Chang Wong

  10. Technische Universität Dortmund, Dortmund, Germany

    Norbert Jesse

  11. Department of Electrical Engineering, National Taiwan University of Science and Technology, 43, Sec. 4, Keelung Rd., 106, Taipei, Taiwan

    Chung-Hsien Kuo

  12. Institute of System Information and Control, National Kaohsiung First University of Science and Technology, 2 Juoyue Road, Nantsu District, 811, Kaohsiung City, Taiwan

    Haw-Ching Yang

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© 2011 Springer-Verlag Berlin Heidelberg

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Tu, KY., Li, MH. (2011). Taguchi Method Optimization for PCB Lamination Process. In: Li, TH.S., et al. Next Wave in Robotics. FIRA 2011. Communications in Computer and Information Science, vol 212. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23147-6_22

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  • DOI: https://doi.org/10.1007/978-3-642-23147-6_22

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-23146-9

  • Online ISBN: 978-3-642-23147-6

  • eBook Packages: Computer ScienceComputer Science (R0)

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