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Chips 2020 pp 429–437Cite as

The Extreme-Technology Industry

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Abstract

The persistent annual R&D quota of >15% of revenue in the semiconductor industry has been and continues to be more than twice as high as the OECD definition for High-Technology Industry. At the frontiers of miniaturization, the Cost-of-Ownership (COO) continues to rise upwards to beyond 10 billion $ for a Gigafactory. Only leaders in the world market for selected processors and memories or for foundry services can afford this. Others can succeed with high-value custom products equipped with high-performance application-specific standard products acquired from the leaders in their specific fields or as fabless original-device manufacturers buying wafers from top foundries and packaging/testing from contract manufacturers, thus eliminating the fixed cost for a factory. An overview is offered on the leaders in these different business models. In view of the coming highly diversified and heterogeneous world of nanoelectronic-systems competence, the point is made for global networks of manufacturing and services with the highest standards for product quality and liability.

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References

  1. The McClean report. www.icinsights.com (2010)

  2. IC Insights, after D. McGraw: Taiwan to beat Japan wafer capacity. http://www.eetasia.com/ART_8800626005_480200.HTM. Nov. 16, 2010

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Correspondence to Bernd Hoefflinger .

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© 2011 Springer-Verlag Berlin Heidelberg

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Hoefflinger, B. (2011). The Extreme-Technology Industry. In: Hoefflinger, B. (eds) Chips 2020. The Frontiers Collection. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23096-7_21

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  • DOI: https://doi.org/10.1007/978-3-642-23096-7_21

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-22399-0

  • Online ISBN: 978-3-642-23096-7

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