Abstract
The yield curve of bonds is an instrument that gives us the necessary information for valuing deterministic financial cash flows, measuring the economic market expectations and testing the effectiveness of monetary policy decisions. In the present paper, we focus on fair price calculation and residual analytics of sample bond by different models to find most effective method for china bond interest rate modeling.
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References
Yu, J.: Yiming Review and development of yield curve theory and its application (2008)
Zhao, Y.: Comparison and analysis of the construction of Chinese bond yield curve. Shanghai Finance (9), 29–31 (2003)
Zhu, S., Chen, J.: Empirical research on the maturity structure of bond interest rate. Finance Research (10), 63–73 (2003)
Zhu, F.: Estimation of current yield curve of bonds. Securities Market Herald 4, 31–36 (2003)
Nelson, C.R., Siegel, A.F.: Parsimonious Modeling of Yield Curves. Journal of Business 60-4 (1987)
Svensson, L.E.O.: Estimating and Interpreting Forward Rates: Sweden 1992-4. National Bureau of Economic Research Working Paper #4871 (1994)
Fisher, M., Nychka, D., Zervos, D.: Fitting the Term Structure of Interest Rates with Smoothing Splines. Board of Governors of the Federal Reserve System (U.S.), Finance and Economics discussion Series 95-1 (1994)
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Zheng, Y. (2011). Empirical Research on Yield Curve of China Bond Market. In: Shen, G., Huang, X. (eds) Advanced Research on Computer Science and Information Engineering. CSIE 2011. Communications in Computer and Information Science, vol 152. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-21402-8_7
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DOI: https://doi.org/10.1007/978-3-642-21402-8_7
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-21401-1
Online ISBN: 978-3-642-21402-8
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