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Low-Cost Platform Technology for LWIR Sensor Arrays for Use in Automotive Night Vision and Other Applications

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Advanced Microsystems for Automotive Applications 2011

Part of the book series: VDI-Buch ((VDI-BUCH))

Abstract

In the EU FP7 project "ADOSE" a new approach has been used to develop a new cost efficient technology by adapting a volume proven integrated MEMS process for the production of a suspended thermodiode array. As low-cost was to be the key feature of the project the focus was set on fully semiconductor compatible production without the need for dedicated equipment and on the use of cost efficient MEMS technologies like wafer-level vacuum encapsulation. A first proof-of-concept integrated FIR array with 42 x 28 pixels was already published [1], now the final ADOSE design with 100 x 50 pixel resolution is produced and under evaluation. While the ADOSE chip targets the requirements of a low-end “Hot-Spot-Detector”, many applications require higher resolutions. As the technology used in ADOSE inherits some limitations from its pressure sensor ancestor, we advance the technology to get rid of these and achieve a low-cost and high-res imager. Here we present the results from ADOSE and give an outlook on the new BMBF-funded Spitzencluster MicroTEC Südwest project RTFIR.

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References

  1. Reinhart, K.F., et al.‚ Low-cost approach for Far-Infrared Sensor Arrays for Hot-Spot Detection in Automotive Night Vision Systems: In: G. Meyer, J. Valldorf and W. Gessner, Advanced Microsystems for Automotive Applications 2009, Springer Berlin Heidelberg, 2009.

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© 2011 Springer-Verlag Berlin Heidelberg

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Herrmann, I. et al. (2011). Low-Cost Platform Technology for LWIR Sensor Arrays for Use in Automotive Night Vision and Other Applications. In: Meyer, G., Valldorf, J. (eds) Advanced Microsystems for Automotive Applications 2011. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-21381-6_9

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  • DOI: https://doi.org/10.1007/978-3-642-21381-6_9

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-21380-9

  • Online ISBN: 978-3-642-21381-6

  • eBook Packages: EngineeringEngineering (R0)

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