Abstract
State-of-the-art technology today stands for bonding as the joining technique in construction and connection technology for fibre and integrated optical sensors. Therefore, mainly commercially available adhesive systems are used. The task for fibre-chip-coupling was to develop a suitable adhesive system to fulfil the special requirements of coupling the individual parts by obtaining the best possible optical properties (for a good data transmission).
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© 2004 Springer-Verlag Berlin Heidelberg
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Battermann, A. (2004). Nanoscalic Sol-Gel-Fillers in Fibre-Chip-Adhesives. In: Knobloch, H., Kaminorz, Y. (eds) MicroNano Integration. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18727-8_31
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DOI: https://doi.org/10.1007/978-3-642-18727-8_31
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-62265-6
Online ISBN: 978-3-642-18727-8
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