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MEMS Processing and Fabrication Techniques and Technology—Silicon-Based Micromachining

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Microsystems and Nanotechnology

Abstract

The silicon-based micromachining technology, which is originated from the silicon IC (integrated circuits) technology, is the mainstream technology for MEMS fabrication, and the most MEMS products on market are manufactured with this technology. The silicon-based micromachining technologies can be divided into two categories: surface micromachining technology and bulk micromachining technology. Instead of introducing detailed individual techniques, this chapter will focus on utilizing and combining different processes to achieve different device fabrication and meet different requirements. For surface micromachining, isolation, metallization and monolithic integration are specially emphasized; while for bulk micromachining, we discuss more details on different sets of processes after a brief introduction of individual processes, such as DRIE and bonding.

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  1. Institute of Microelectronics, Peking University, Beijing, China

    Zhihong Li, Bo Liu & Wei Wang

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  1. Zhihong Li
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  1. Department of Precision Instruments & Mechanology, Tsinghua University, Beijing, 100084, China

    Zhaoying Zhou

  2. Center for Nanostructure Characterization and Fabrication (CNCF), Georgia Institute of Technology, Atlanta, GA, 30332-0245, USA

    Liwei Lin

  3. Department of Mechanical Engineering, University of California at Berkeley, Berkeley, CA, 94720-1740, USA

    Zhonglin Wang

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Li, Z., Liu, B., Wang, W. (2012). MEMS Processing and Fabrication Techniques and Technology—Silicon-Based Micromachining. In: Zhou, Z., Wang, Z., Lin, L. (eds) Microsystems and Nanotechnology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18293-8_9

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