Abstract
Much of the electronics of future cars will be physically integrated together with sensors and actuators to mechatronic systems. Depending on the location of such a system, the maximum temperature experienced by the electronics may exceed the mil-specified limit of 125°C. The strict low cost requirements in the automotive industry favour only silicon-based electronic systems as promising approach for mass production. In this article, first of all the influence of temperature on device characteristic will be discussed. Then, the advantage of SOI devices with respect to elevated operation temperatures will be demonstrated. Finally, processes for the fabrication of SOI materials are presented.
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© 2002 Springer-Verlag Berlin Heidelberg
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Seegebrecht, P. (2002). Materials for Electronic Systems in Automotive Applications — Silicon On Insulator (SOI). In: Krueger, S., Gessner, W. (eds) Advanced Microsystems for Automotive Applications Yearbook 2002. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18213-6_8
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DOI: https://doi.org/10.1007/978-3-642-18213-6_8
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-62114-7
Online ISBN: 978-3-642-18213-6
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