Abstract
We present a single-chip CMOS solution for a pressure transducer reaching an 1% accuracy over the temperature range between -40°C and 125°C after calibration that delivers a ratiometric analog output voltage and a pulse density digital output. Two on-chip sensors are cointegrated: a surface-micromachined capacitive pressure sensor and temperature sensor using parasitic bipolar transistors. The surface-micromachined capacitive pressure sensor is fully compatible to a standard CMOS-process and therefore cost-optimized when compared to piezoresistive sensor elements. The sensor signal processing covers the sensor readout, the linearization, and the temperature sensor based compensation of the temperature sensitivity. A highly efficient parallel and automated calibration based on ∑△-modulators requires only a few calibration points for full pressure and temperature range. The two-dimensional calibration procedure has been optimised for parallel processing and allows efficient mass production. The sensor chip family has been fabricated in an 1.2 μm CMOS-process with surface micromachining extension and occupies a chip area of 11.8 mm.2 The power consumption of the sensor chip is 6 mW using a 5 V power supply.
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References
H. Dudaicevs et al., “A fully integrated surface micromachined pressure sensor with low temperature dependence”, Int. Conference on Solid-State Sensors and Actuators, 1995
D. Weiler et al., “An Absolute Air Pressure Smart Sensor Family with 2 Dimensional Calibration”, Proc. of the 25. European Solid-State Circuits Conference, Duisburg, Gemany, 1999
P. Malcovati et al., “Smart Sensor Interface with A/D Conversion and Programmable Calibration”, IEEE Journal of Solid-State Circuits, Vol. 29, No. 8, 1994
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© 2000 Springer-Verlag Berlin Heidelberg
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Weiler, D., Machul, O., Hammerschmidt, D., Amelung, J., Hosticka, B.J. (2000). A Single-Chip Smart Pressure Sensor Family with 2 Dimensional Calibration. In: Krüger, S., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2000. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18146-7_23
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DOI: https://doi.org/10.1007/978-3-642-18146-7_23
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-62107-9
Online ISBN: 978-3-642-18146-7
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