Abstract
This paper illustrates a new and cost effective approach to the design and manufacture of intelligent sensors and control electronics that reliably operate up to 300 Degrees Centigrade. A description of this Silicon-On-Insulator (SOI) technology for creating both the sensors and integrated circuits is provided. Measured results that demonstrate the inherent reliability of this technology at high temperatures are presented. Representative distributed control architectures and applications such as engine control units; valve position sensors and exhaust gas re-circulation sensor electronics are illustrated.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
SOI Devices For High Temperature Applications, Bruce Ohme and others, Brd International HiTec Conference, June 1998.
Needs And Applications of High Temperature LSIs for Automotive Electronic Systems, Masayuki Hattori, Toyota Motor Corporation, July 1999 HiTen Conference.
Future High Temperature Needs, Dr. Wolfgang Wondrak, Daimler Chrysler, December 1998 HiTen Workshop.
Johannes Guggenmos, BMW Inc., September 1998.
Some Reliability Aspects Of High Temperature ICs, February 1998, Phillip Brusius, Honeywell Inc.
Reliable Electronics for High Temperature Downhole Applications, October 1999, Ben Gingerich and Phillip Brusius of Honeywell Inc., Ian McClean of Expro Inc.
May 1998 Philips Semiconductor UZZ9000 Data Sheet.
Reliability of Commercial Plastic Encapsulated Microelectronics at Temperatures From 125 To 300C, Patrick McCluskey and others, July 1999 HiTen Conference.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2000 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Wick, D.G. (2000). Realising Distributed Engine Control Subsystems Through Application of High Temperature Intelligent Engine Sensors and Control Electronics. In: Krüger, S., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2000. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18146-7_12
Download citation
DOI: https://doi.org/10.1007/978-3-642-18146-7_12
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-62107-9
Online ISBN: 978-3-642-18146-7
eBook Packages: Springer Book Archive